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TECHNICAL BRIEFS

The Thermal Resistance of Adhesive Bonds

[+] Author and Article Information
D. M. Lewis

Sverdrup and Parcel and Associates, Inc., St. Louis, Mo.

H. J. Sauer

University of Missouri at Rolla, Rolla, Mo.

J. Heat Transfer 87(2), 310-311 (May 01, 1965) (2 pages) doi:10.1115/1.3689097 History: Received November 12, 1964

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Copyright © 1965 by ASME
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