0
RESEARCH PAPERS

The Effect of Thermal Conductivity of Plating Material on Thermal Contact Resistance

[+] Author and Article Information
B. Mikic

Massachusetts Institute of Technology, Cambridge, Mass.

G. Carnasciali

Universidad de Los Andes, Bogota, Colombia

J. Heat Transfer 92(3), 475-481 (Aug 01, 1970) (7 pages) doi:10.1115/1.3449694 History: Revised May 01, 1969; Received June 06, 1969; Online August 11, 2010

Abstract

Plating of a base material of low thermal conductivity with materials of high thermal conductivity was considered. The solution for an elemental heat channel (single contact) is given. Experimental results for contact resistance of a plated single contact agreed well with the prediction. In general, results indicate that considerable reduction in thermal contact resistance can be achieved by plating; for example, stainless steel plated with copper of a thickness of the order of the contact size radius will reduce the resistance by more than an order of magnitude. A procedure is presented for extending the results for a plated elemental heat channel to the calculation of thermal contact resistance for nominally flat-plated surfaces in a vacuum.

Copyright © 1970 by ASME
Your Session has timed out. Please sign back in to continue.

References

Figures

Tables

Errata

Discussions

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In