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RESEARCH PAPERS

Conduction of Heat across Rectangular Cellular Enclosures

[+] Author and Article Information
J. Eftekhar, G. Darkazalli, A. Haji-Sheikh

Mechanical Engineering Department, University of Texas at Arlington, Arlington, Tex.

J. Heat Transfer 103(3), 591-595 (Aug 01, 1981) (5 pages) doi:10.1115/1.3244507 History: Received July 10, 1980; Online October 20, 2009

Abstract

A simplified analytical model for the computation of thermal conduction across rectangular-celled enclosures based on the assumption of quasi-one-dimensional conduction in the cell partitions is presented. The rectangular enclosures may contain solid or liquid for which the conduction is two or three-dimensional depending on the geometrical configuration. Additional assumptions concerning radiation interchange between participating surfaces are necessary when the enclosure contains a stagnant gas. This analytical model leads to a closed form solution for temperature distribution in the partitions and the multidimensional conductive region. A parametric study of heat flux is presented. The numerical data define a range of parameters for which a one-dimensional conduction model is satisfactory.

Copyright © 1981 by ASME
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