0
RESEARCH PAPERS

Effects of Size of Simulated Microelectronic Chips on Boiling and Critical Heat Flux

[+] Author and Article Information
K.-A. Park

Korea Standards Research Institute, Taejon, Chungnam 300-31, Korea

A. E. Bergles

Rensselaer Polytechnic Institute, Troy, NY 12180-3590

J. Heat Transfer 110(3), 728-734 (Aug 01, 1988) (7 pages) doi:10.1115/1.3250552 History: Received July 18, 1986; Online October 20, 2009

Abstract

Microelectronic chips were simulated with thin foil heaters supplied with d-c power and arranged in two vertical configurations: flush mounted on a circuit board substrate or protruding from the substrate about 1 mm. Heat transfer characteristics (midpoint) were obtained with varying height (1 mm to 80 mm) and width (2.5 mm to 70 mm) in R-113. Two types of incipient boiling temperature overshoot were observed with saturated boiling. The inception of boiling depended greatly on the location of the active boiling sites on the heater. For arrays, the inception of boiling for the top heater took place at lower superheat than for the bottom heater. Heater size had no effect on established boiling, in contrast to results reported previously in the literature. The critical heat flux for wide heaters increased with decreasing heater height, as expected. The critical heat flux also increased with decreasing width. Correlations are presented that describe these effects.

Copyright © 1988 by ASME
Your Session has timed out. Please sign back in to continue.

References

Figures

Tables

Errata

Discussions

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In