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RESEARCH PAPERS

Convection Heat Transfer in Electronic Equipment Cooling

[+] Author and Article Information
F. P. Incropera

Heat Transfer Laboratory, School of Mechanical Engineering, Purdue University, West Lafayette, IN 47907

J. Heat Transfer 110(4b), 1097-1111 (Nov 01, 1988) (15 pages) doi:10.1115/1.3250613 History: Received February 08, 1988; Online October 20, 2009

Abstract

To maintain the best possible thermal environment in electronic packages, the engineer must establish the most efficient path for heat transfer from the electronic devices to an external cooling agent. The path is typically subdivided into internal and external components, representing, respectively, heat transfer by conduction through different materials and interfaces separating the devices from the package surface and heat transfer by convection from the surface to the coolant. Depending on the scale and speed of the electronic circuits, as well as on constraints imposed by nonthermal considerations, the coolant may be a gas or a liquid and heat transfer may be by natural, forced, or mixed convection or, in the case of a liquid, by pool or forced convection boiling. In this paper a comprehensive review of convection cooling options is provided.

Copyright © 1988 by ASME
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