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RESEARCH PAPERS

Temperature Response of a Heated Cylinder Subject to Side Cooling: Asymptotic and Numerical Solutions

[+] Author and Article Information
K. Ramakrishna

Technology Laboratory, IBM Corporation, Endicott, NY 13760

I. M. Cohen, P. S. Ayyaswamy

Department of Mechanical Engineering and Applied Mechanics, School of Engineering and Applied Science, University of Pennsylvania, Philadelphia, PA 19104–6315

J. Heat Transfer 111(3), 592-597 (Aug 01, 1989) (6 pages) doi:10.1115/1.3250723 History: Received February 25, 1988; Online October 20, 2009

Abstract

The temperature response of a cylinder, subject to heat input at one end and heat loss from its side by radiation and natural convection, is studied analytically and numerically. A singular perturbation expansion gives the limiting case of large heat flux. The governing equations for arbitrary heat flux are solved numerically. The results of this investigation are useful for application to the microelectronic interconnection process using the ball bonding technique.

Copyright © 1989 by ASME
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