0
RESEARCH PAPERS

A Two-Wavelength Holographic Interferometry Study on the Solidification of a Binary Alloy Around a Horizontal Pipe

[+] Author and Article Information
T. L. Spatz, D. Poulikakos

Mechanical Engineering Department, University of Illinois at Chicago, Chicago, IL 60680

J. Heat Transfer 114(4), 998-1010 (Nov 01, 1992) (13 pages) doi:10.1115/1.2911912 History: Received September 01, 1991; Revised February 01, 1992; Online May 23, 2008

Abstract

An experimental study on the transient outward solidification of a transparent binary alloy from an internally cooled horizontal pipe is reported in this paper. Two-wavelength holographic interferometry was used to visualize the density field in the liquid phase and to measure the local heat and mass transfer rates at the mush/liquid interface at characteristic times, Stefan numbers, and initial concentrations. The presence of double diffusive convection in the liquid phase greatly affected the local Nusselt and Sherwood numbers. The dependence of the pipe wall temperature, the solidified volume fraction, and the shape of the solid/mush and mush/liquid interfaces on the Stefan number, time, and initial concentration were also determined. The flow field in the liquid phase was visualized with the help of shadowgraphs. Interface photographs presented in this paper demonstrate the effect of the initial concentration on the structure of the mush/liquid interface, which varies from rather smooth to highly dendritic.

Copyright © 1992 by The American Society of Mechanical Engineers
Your Session has timed out. Please sign back in to continue.

References

Figures

Tables

Errata

Discussions

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In