RESEARCH PAPERS: Heat Conduction in Thin Films

Prediction and Measurement of the Thermal Conductivity of Amorphous Dielectric Layers

[+] Author and Article Information
K. E. Goodson, M. I. Flik

Department of Mechanical Engineering, Massachusetts Institute of Technology, Cambridge, MA 02139

L. T. Su, D. A. Antoniadis

Department of Electrical Engineering and Computer Science, Massachusetts Institute of Technology, Cambridge, MA 02139

J. Heat Transfer 116(2), 317-324 (May 01, 1994) (8 pages) doi:10.1115/1.2911402 History: Received January 01, 1993; Revised July 01, 1993; Online May 23, 2008


Thermal conduction in amorphous dielectric layers affects the performance and reliability of electronic circuits. This work analyzes the influence of boundary scattering on the effective thermal conductivity for conduction normal to amorphous silicon dioxide layers, kn,eff . At 10 K, the predictions agree well with previously reported data for deposited layers, which show a strong reduction of kn,eff compared to the bulk conductivity, kbulk . A steady-state technique measures kn,eff near room temperature of silicon dioxide layers fabricated using oxygen-ion implantation (SIMOX). The predictions and the SIMOX data, which agree closely with kbulk , show that boundary scattering is not important at room temperature. Lower than bulk conductivities of silicon dioxide layers measured elsewhere near room temperature must be caused by interfacial layers or differences in microstructure or stoichiometry.

Copyright © 1994 by The American Society of Mechanical Engineers
Your Session has timed out. Please sign back in to continue.






Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In