0
TECHNICAL BRIEFS

Thermal Contact Conductance of Ceramic Substrate Junctions

[+] Author and Article Information
K. C. Chung

Department of Mechanical Engineering, National Yunlin Institute of Technology, Touliu, 640, Taiwan

H. K. Benson, J. W. Sheffield

Department of Mechanical and Aerospace Engineering and Engineering Mechanics, University of Missouri—Rolla, Rolla, MO 65401

J. Heat Transfer 117(2), 508-510 (May 01, 1995) (3 pages) doi:10.1115/1.2822552 History: Received September 01, 1993; Revised August 01, 1994; Online December 05, 2007

First Page Preview

View Large
First page PDF preview
FIGURES IN THIS ARTICLE
Copyright © 1995 by The American Society of Mechanical Engineers
Your Session has timed out. Please sign back in to continue.

References

Figures

Tables

Errata

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In