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RESEARCH PAPERS: Phase-Change Heat Transfer

Experimental Investigation of Interfacial Thermal Conductance for Molten Metal Solidification on a Substrate

[+] Author and Article Information
G.-X. Wang, E. F. Matthys

Department of Mechanical and Environmental Engineering, University of California, Santa Barbara, CA 93106

J. Heat Transfer 118(1), 157-163 (Feb 01, 1996) (7 pages) doi:10.1115/1.2824029 History: Received April 01, 1995; Revised October 01, 1995; Online December 05, 2007

Abstract

Experiments have been conducted to quantify the interfacial thermal conductance between molten copper and a cold metallic substrate, and in particular to investigate the heat transfer variation as the initial liquid/solid contact becomes a solid/solid contact after nucleation. A high heat transfer coefficient during the earlier liquid cooling phase and a lower heat transfer coefficient during the subsequent solid splat cooling phase were estimated through matching of model calculations and measured temperature history of the sample. The dynamic variations in the interfacial heat transfer resulting from the solidification process were quantified for splat cooling and were found to be affected by the melt superheat, the substrate material, and the substrate surface finish.

Copyright © 1996 by The American Society of Mechanical Engineers
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