TECHNICAL PAPERS: Microscale Heat Transfer

Molecular Dynamics Study of Solid Thin-Film Thermal Conductivity

[+] Author and Article Information
J. R. Lukes, D. Y. Li

Department of Mechanical Engineering, University of California, Berkeley, CA 94720-1740

X.-G. Liang

Department of Engineering Mechanics, Tsinghua University, Beijing 100084, Chinae-mail: liangxg@tsinghua.edu.cn

C.-L. Tien

University of California, Berkeley, CA 94720-1740e-mail: nancie@uclink4.berkeley.edu

J. Heat Transfer 122(3), 536-543 (Mar 01, 2000) (8 pages) doi:10.1115/1.1288405 History: Received February 28, 1999; Revised March 01, 2000
Copyright © 2000 by ASME
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Simulation cell schematic drawings: (a) bulk thermal conductivity, (b) perpendicular thermal conductivity  
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Temperature in each x-plane of a five regular plane simulation for fixed and free boundaries
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Velocity distributions at T=0.5 for various cross sections and sampled time steps: (a) 4×4, 10,000; (b) 6×6, 10,000; (c) 4×4, 30,000; (d) 6×6, 30,000
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Calculated and experimental bulk thermal conductivities at T=0.3 and 0.5 versus number of atoms
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Planck spectral distribution. Shaded areas indicate the fraction of total phonon emissive power allowed by the molecular dynamics simulation. (a) and (b) illustrate the effect of temperature, and (c) and (d) illustrate the effect of domain size.
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Calculated, bulk experimental, and equation of photon radiative transfer (EPRT) thermal conductivities versus film thickness at various temperatures
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Effect of number of unit cells per bath on thermal conductivity
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Effect of cross section on thermal conductivity




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