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TECHNICAL PAPERS: Porous Media, Particles, and Droplets

Thermal Interaction at the Interface Between a Porous Medium and an Impermeable Wall

[+] Author and Article Information
Sung Jin Kim, Duckjong Kim

Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology, Taejon, 305-701, Korea

J. Heat Transfer 123(3), 527-533 (Jan 01, 2001) (7 pages) doi:10.1115/1.1370504 History: Received June 26, 2000; Revised January 01, 2001
Copyright © 2001 by ASME
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References

Figures

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Heat transfer at the interface between the porous medium and the impermeable wall 1
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Effects of parameters on the heat flux distribution at the interface: (a) thermal conductivity (s/H=1,wc/(wc+ww)=0.5); (b) thickness of the substrate (ks/kf=100,wc/(wc+ww)=0.5); and (c) width ratio of the microchannel heat sink (ks/kf=100,s/H=1) [αs=2,H=100 (μm),kf=0.59 (W/m°C)].
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Effects of parameters on ΔT; (a) thermal conductivity; (b) thickness of the substrate; and (c) width ratio of the microchannel heat sink [αs=2,H=100 (μm),kf=0.59 (W/m°C)].
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Comparison with the experimental results for thermal resistance of the microchannel heat sink
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Sintered porous channel
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Overall Nusselt number of the sintered porous channel

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