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TECHNICAL PAPERS: Porous Media, Particles, and Droplets

Thermal Interaction at the Interface Between a Porous Medium and an Impermeable Wall

[+] Author and Article Information
Sung Jin Kim, Duckjong Kim

Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology, Taejon, 305-701, Korea

J. Heat Transfer 123(3), 527-533 (Jan 01, 2001) (7 pages) doi:10.1115/1.1370504 History: Received June 26, 2000; Revised January 01, 2001
Copyright © 2001 by ASME
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References

Sahraoui,  M., and Kaviany,  M., 1993, “Slip and No-Slip Temperature Boundary Conditions at Interface of Porous, Plain Media: Conduction,” Int. J. Heat Mass Transf., 36, pp. 1019–1033.
Sahraoui,  M., and Kaviany,  M., 1994, “Slip and No-Slip Temperature Boundary Conditions at the Interface of Porous, Plain Media: Convection,” Int. J. Heat Mass Transf., 37, pp. 1029–1044.
Amiri,  A., Vafai,  K., and Kuzay,  T. M., 1995, “Effects of Boundary Conditions on Non-Darcian Heat Transfer Through Porous Media and Experimental Comparisons,” Numer. Heat Transfer, Part A, 27, pp.651–664.
Hwang,  G. J., Wu,  C. C., and Chao,  C. H., 1995, “Investigation of Non-Darcian Forced Convection in an Asymmetrically Heated Sintered Porous Channel,” ASME J. Heat Transfer, 117, pp.725–732.
Koh,  J. C. Y., and Colony,  R., 1986, “Heat Transfer of Microstructures for Integrated Circuits,” Int. Commun. Heat Mass Transfer, 13, pp. 89–98.
Shah, R. K., and London, A. L., 1978, Laminar Flow Forced Convection in Ducts, Academic, New York.
Patankar, S. V., 1980, Numerical Heat Transfer and Fluid Flow, McGraw-Hill, New York.
Kim,  S. J., and Kim,  D., 1999, “Forced Convection in Microstructures for Electronic Equipment Cooling,” ASME J. Heat Transfer, 121, pp.639–645.
Kim,  S. J., Kim,  D., and Lee,  D. Y., 2000, “On the Local Thermal Equilibrium in Microchannel Heat Sinks,” Int. J. Heat Mass Transf., 43, pp. 1735–1748.
Tuckerman,  D. B., and Pease,  R. F. W., 1981, “High-Performance Heat Sinking for VLSI,” IEEE Electron Device Lett., 2, pp. 126–129.
Hwang,  G. J., and Chao,  C. H., 1994, “Heat Transfer Measurement and Analysis for Sintered Porous Channels,” ASME J. Heat Transfer, 116, pp. 456–464.
Kim,  S. J., and Kim,  D., 2000, “Discussion on Heat Transfer Measurement and Analysis for Sintered Porous Channels,” ASME J. Heat Transfer, 122, pp.632–633.

Figures

Grahic Jump Location
Heat transfer at the interface between the porous medium and the impermeable wall 1
Grahic Jump Location
Effects of parameters on the heat flux distribution at the interface: (a) thermal conductivity (s/H=1,wc/(wc+ww)=0.5); (b) thickness of the substrate (ks/kf=100,wc/(wc+ww)=0.5); and (c) width ratio of the microchannel heat sink (ks/kf=100,s/H=1) [αs=2,H=100 (μm),kf=0.59 (W/m°C)].
Grahic Jump Location
Effects of parameters on ΔT; (a) thermal conductivity; (b) thickness of the substrate; and (c) width ratio of the microchannel heat sink [αs=2,H=100 (μm),kf=0.59 (W/m°C)].
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Comparison with the experimental results for thermal resistance of the microchannel heat sink
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Sintered porous channel
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Overall Nusselt number of the sintered porous channel

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