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TECHNICAL PAPERS: Thermal Systems

Assessment of Overall Cooling Performance in Thermal Design of Electronics Based on Thermodynamics

[+] Author and Article Information
Ken Ogiso

Tokyo University of Technology, Department of Mechatronics, 1404-1, Katakura-cho, Hachioji-city, Tokyo, 192-0982, Japane-mail: ogiso@cc.teu.ac.jp

J. Heat Transfer 123(5), 999-1005 (Feb 20, 2001) (7 pages) doi:10.1115/1.1387025 History: Received December 07, 1999; Revised February 20, 2001
Copyright © 2001 by ASME
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References

Figures

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Heat flow in forced convection cooling
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Flow model inside a circular pipe
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Entropy generation rate versus flow velocity
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Entropy generation rate versus heat transfer area
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Example of experimental thermal resistance
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Entropy generation rate and related parameters
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Entropy generation rates for heat sinks (A-E)
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User selection for “PC” cooling

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