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TECHNICAL PAPERS

Computations of the Flow and Heat Transfer in Microdevices Using DSMC With Implicit Boundary Conditions

[+] Author and Article Information
Yichuan Fang, William W. Liou

Department of Mechanical and Aeronautical Engineering, Western Michigan University, Kalamazoo, MI 49008

J. Heat Transfer 124(2), 338-345 (Oct 01, 2001) (8 pages) doi:10.1115/1.1447933 History: Received May 02, 2001; Revised October 01, 2001
Copyright © 2002 by ASME
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References

Figures

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Simulated micro-geometries
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Comparison of the temperature profile for micro-Couette flow
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Evolution of the downstream pressure, Case 2
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(a) Evolution of mass fluxes, Case 2; and (b) evolution of the streamwise velocity, Case 2.
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Streamwise velocity magnitude contours
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Slip velocity on the wall
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Comparison of normalized slip velocity distributions
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Comparison of temperature profiles
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Sketch for patterned microchannel
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Temperature distributions
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Temperature-jump on the upper and lower wall
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Comparison of heat transfer on the upper wall

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