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TECHNICAL PAPERS

Enhanced Boiling of FC-72 on Silicon Chips With Micro-Pin-Fins and Submicron-Scale Roughness

[+] Author and Article Information
H. Honda, H. Takamastu

Institute of Advanced Material Study, Kyushu University, Kasuga, Fukuoka 816-8580, Japan

J. J. Wei

Interdisciplinary Graduate School of Engineering Sciences, Kyushu University, Kasuga, Fukuoka 816-8580, Japan

J. Heat Transfer 124(2), 383-390 (Aug 21, 2001) (8 pages) doi:10.1115/1.1447937 History: Received April 30, 2001; Revised August 21, 2001
Copyright © 2002 by ASME
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References

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Figures

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Schematic diagram of experimental apparatus
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Details of test section
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AFM images of chips S and EPF
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Variation of measured wall and liquid temperatures with heat flux; ΔTsub=25 K,yg=2.1×10−4∼3.4×10−4
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Photographs of boiling phenomena on vertically mounted chip EPF; ΔTsub=25 K, gas dissolved (yg=2.6×10−3∼3.3×10−3)
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Sequence of boiling phenomena on vertically mounted chip EPF; ΔTsub=25 K, gas dissolved (yg=2.6×10−3∼3.3×10−3);ΔTsat=9.1 K;q=8.74 W/cm2
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Comparison of boiling curves for vertically mounted and horizontally mounted chip EPF; ΔTsub=25 K,yg=2.6×10−3∼3.3×10−3
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Comparison of boiling curves; ΔTsub=0 K,yg=2.1×10−4∼3.4×10−4
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Comparison of boiling curves; ΔTsub=25 K,yg=2.1×10−4∼3.4×10−4
Grahic Jump Location
Comparison of boiling curves; ΔTsub=25 K,yg=2.6×10−3∼3.3×10−3
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Comparison of boiling curves; ΔTsub=45 K,yg=2.1×10−4∼3.4×10−4
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Comparison of boiling curves; ΔTsub=45 K,yg=2.6×10−3∼3.3×10−3
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Variation of qCHF with ΔTsub

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