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TECHNICAL PAPERS: Conduction

Thermal Contact Conductance of Non-Flat, Rough, Metallic Coated Metals

[+] Author and Article Information
M. A. Lambert

Department of Mechanical Engineering, San Diego State University, San Diego, CA 92182-1323

L. S. Fletcher

Department of Mechanical Engineering, Texas A&M University, College Station, TX 77843-3123

J. Heat Transfer 124(3), 405-412 (May 10, 2002) (8 pages) doi:10.1115/1.1464565 History: Received May 19, 1997; Revised December 20, 2001; Online May 10, 2002
Copyright © 2002 by ASME
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References

Lambert,  M. A., and Fletcher,  L. S., 1993, “A Review of the Thermal Contact Conductance of Junctions with Metallic Coatings and Films,” AIAA Paper No. 92-0709, AIAA Journal of Thermophysics and Heat Transfer, 7(4), pp. 547–554.
O’Callaghan, P. W., Snaith, B., Probert, S. D., and Al-Astrabadi, F. R., 1981, “Prediction of Optimum Interfacial Filler Thickness for Minimum Thermal Contact Resistance,” AIAA Paper 81–1166.
Antonetti,  V. W., and Yovanovich,  M. M., 1985, “Enhancement of Thermal Contact Conductance by Metallic Coatings: Theory and Experiment,” ASME Journal of Heat Transfer, 107, pp. 513–519.
Antonetti,  V. W., and Yovanovich,  M. M., 1988, “Using Metallic Coatings to Enhance Thermal Contact Conductance of Electronic Packages,” Heat Transfer Eng., 9(3), pp. 85–92.
Hegazy, A. A., 1985, “Thermal Joint Conductance of Conforming Rough Surfaces,” Ph.D. dissertation, University of Waterloo, Waterloo, Ontario, Canada.
Clausing,  A. M., and Chao,  B. T., 1965, “Thermal Contact Resistance in a Vacuum Environment,” ASME J. Heat Transfer , 87(3), pp. 243–251.
Mikic, B. B., and Rohsenow, W. M., 1966, “Thermal Contact Conductance,” Technical Report No. 4542-41, Department of Mechanical Engineering, Massachusetts Institute of Technology, Cambridge, Mass., NASA Contract No. NGR 22-009-065.
Nishino, K., Yamashita, S., and Torii, K., 1993, “Thermal Contact Conductance Under Low Applied Load in a Vacuum Environment,” Proceedings of the First International Conference of Aerospace Heat Exchanger Technology, R. K. Shah and A. Hashemi, eds., Palo Alto, California, February 15–17, Elsevier, Amsterdam, pp. 763–788.
Mikic,  B. B., 1970, “Thermal Constriction Resistance Due to Non-Uniform Surface Conditions; Contact Resistance at Non-Uniform Interface Pressure,” Int. J. Heat Mass Transf., 13, pp. 1497–1500.
Greenwood,  J. A., and Tripp,  J. H., 1967, “The Elastic Contact of Rough Spheres,” ASME J. Appl. Mech., 89(1), pp. 153–159.
Hertz, H. R., 1896, Miscellaneous Papers, English Translation, MacMillan and Co., London.
Sasajima,  K., and Tsukada,  T., 1981, “On the Approach Between a Sphere and a Rough Surface (2nd Report-Critical Condition to Yield Plastic Deformation in Contacting Bodies,” (in Japanese), Journal of the Japanese Society of Precision Engineering, 47(6), pp. 694–699.
Tsukada,  T., and Anno,  Y., 1979, “On the Approach Between a Sphere and a Rough Surface (1st Report, Analysis of Contact Radius and Interface Pressure),” (in Japanese), Journal of the Japanese Society of Precision Engineering, 45(4), pp. 473–479.
Lambert, M. A., 1995, “Thermal Contact Conductance of Spherical, Rough Metals,” Ph.D. dissertation, Texas A&M University, College Station, TX.
Yovanovich, M. M., Burde, S. S., and Thompson, J. C., 1977, “Thermal Constriction Resistance of Arbitrary Planar Contacts with Constant Heat Flux,” AIAA Paper No. 76–440.
Antonetti, V. W., 1983, “On the Use of Metallic Coatings to Enhance Thermal Contact Conductance,” Ph.D. dissertation, University of Waterloo, Waterloo, Ontario, Canada.
Lambert, M. A., and Fletcher, L. S., 1996, “Thermal Contact Conductance of Spherical, Rough Metals,” AIChE National Heat Transfer Conference, Houston, TX.
Fried, E., 1966, “Study of Interface Thermal Contact Conductance, Summary Report,” General Electric Company Document No. 66SD4471, Valley Forge, PA.
Mal’kov,  V. A., and Dobashin,  P. A., 1969, “The Effect of Soft-Metal Coatings and Linings on Contact Thermal Resistance,” Inzh.-Fiz. Zh., 17(5), pp. 871–879.
Kang, T. K., Peterson, G. P., and Fletcher, L. S., 1989, “Enhancing the Thermal Contact Conductance Through the Use of Thin Metallic Coatings,” ASME Paper No. 89-HT-23.
Chung, K. C., Sheffield, J. W., and Sauer, Jr., M. J., 1990, “Effect of Metallic Coated Surfaces on Thermal Contact Conductance: An Experimental Study,” 6th Miami International Symposium on Heat and Mass Transfer, Miami Beach, FL.
Sheffield, J. W., Williams, A., Sauer, H. J., Jr., O’Keefe, T. J., and Chung, K. C., 1992, “Enhancement of Thermal Contact Conductance by Transitional Buffering Interfaces (TBI),” National Science Foundation Final Project Rep., NSF Grant No. CTS-8901871 (Thermal Systems Program), University of Missouri, Rolla, MO.
Lambert, M. A., and Fletcher, L. S., 1995, “An Experimental Investigation of the Thermal Contact Conductance of Electroplated Silver Coatings,” AIAA Paper No. 93-0846.

Figures

Grahic Jump Location
Models by (a) Lambert and Fletcher 17 and (b) Antonetti and Yovanovich 34 compared to experimental thermal contact conductance results for electroless nickel plated copper to gold and silver coated (physically vapor deposited (PVD), electroplated, and flame sprayed) aluminum alloy A356-T61 by Lambert and Fletcher 23
Grahic Jump Location
Contacting spherical, rough surfaces showing the macroscopic contact radius, aL,Hz, predicted by Hertz 11, as incorporated in the models by Clausing and Chao 6 and Lambert and Fletcher 17. Note that aL,Hz≤aL. Also shown is an idealized array of micro-contacts.
Grahic Jump Location
Ratio of peak contact pressure P0/P0,Hz (at r=0) for rough and smooth spheres
Grahic Jump Location
Models by (a) Lambert and Fletcher 17 and (b) Antonetti and Yovanovich 34 compared to experimental thermal contact conductance results for physically vapor deposited (PVD) silver on nickel 200 by Antonetti 16
Grahic Jump Location
Models by (a) Lambert and Fletcher 17 and (b) Antonetti and Yovanovich 34 compared to experimental thermal contact conductance results for PVD aluminum and magnesium on stainless steel 304 by Fried 18; nickel, silver, and copper platings on stainless steel by Mal’kov and Dobashin 19; and PVD tin on low alloy steel by O’Callaghan et al. 2
Grahic Jump Location
Models by (a) Lambert and Fletcher 17 and (b) Antonetti and Yovanovich 34 compared to experimental thermal contact conductance results for physically vapor deposited (PVD) lead, tin, and indium on aluminum alloy 6061-T6 by Kang et al. 20
Grahic Jump Location
Models by (a) Lambert and Fletcher 17 and (b) Antonetti and Yovanovich 34 compared to experimental thermal contact conductance results for physically vapor deposited (PVD) aluminum, lead, and indium on aluminum alloy 6061-T651 by Chung et al. 21
Grahic Jump Location
Models by (a) Lambert and Fletcher 17 and (b) Antonetti and Yovanovich 34 compared to experimental thermal contact conductance results for (PVD) copper, copper/carbon, silver, and silver/carbon on aluminum alloy 6061-T651 by Sheffield et al. 22

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