TECHNICAL PAPERS: Evaporative Boiling and Condensation

A Cavity Activation and Bubble Growth Model of the Leidenfrost Point

[+] Author and Article Information
John D. Bernardin, Issam Mudawar

Boiling and Two-Phase Flow Laboratory, School of Mechanical Engineering, Purdue University, West Lafayette, IN 47907

J. Heat Transfer 124(5), 864-874 (Sep 11, 2002) (11 pages) doi:10.1115/1.1470487 History: Received June 30, 2001; Revised January 07, 2002; Online September 11, 2002
Copyright © 2002 by ASME
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Temperature-time history of a surface during quenching in a bath of liquid
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Sessile droplet evaporation curve and corresponding photographs of water droplets approximately 2 ms after contact with a polished aluminum surface
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Depiction of (a) an actual surface profile exhibiting self-similarity and the corresponding cavity size distribution, (b) sensitivity limitation of a stylus of a surface contact profilometer, and (c) a polished aluminum surface profile (with an arithmetic average surface roughness of 26 nm) measured with a contact profilometer and the corresponding cavity size distribution
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Cavity size distributions for a polished aluminum surface determined from scanning electron microscopy images at (a) 1000×magnification, (b) 4800×magnification, and (c) combined magnifications  
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Temperature dependence of vapor bubble growth for water as predicted by the numerical solution to the Rayleigh equation
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(a) Transient maximum cavity activation and bubble radius and (b) nearest-neighbor cavity distances for 25 percent cavity activation at three different times following liquid-solid contact for water on a polished aluminum surface with an interface temperature of 145°C
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Schematic representation of different forms of cavity cancellation: (a) poor vapor entrapment, (b) neighbor bubble overgrowth, and (c) bubble merging
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Transient cavity nucleation model including (a) cavity nucleation superheat criteria and corresponding cavity size distribution with transient activation window, and (b) transient maximum and minimum active cavity radii for water in contact with a hot surface with an interface temperature of 165°C
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Temperature dependence of the (a) transient vapor layer coverage and (b) average vapor layer growth rate for a sessile water droplet on a polished aluminum surface
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Average vapor layer growth rate for sessile droplets of (a) water on various polished metallic surfaces and (b) acetone, FC-72, and water on polished aluminum




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