0
TECHNICAL PAPERS: Heat Transfer Enhancement

Effects of Varying Geometrical Parameters on Boiling From Microfabricated Enhanced Structures

[+] Author and Article Information
C. Ramaswamy

IBM Corporation, Hopewell Junction, NY 12533

Y. Joshi

G. W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA 30332

W. Nakayama

ThermTech International, Kanagawa, Japan 255-0004

W. B. Johnson

Laboratory for Physical Sciences, College Park, MD 20740

J. Heat Transfer 125(1), 103-109 (Jan 29, 2003) (7 pages) doi:10.1115/1.1513575 History: Received May 02, 2001; Revised June 11, 2002; Online January 29, 2003
Copyright © 2003 by ASME
Your Session has timed out. Please sign back in to continue.

References

Thome, J. R., 1990, Enhanced Boiling Heat Transfer, Hemisphere Publishing, NY.
Webb, R. L., 1994, Principles of Enhanced Heat Transfer, John Wiley & Sons, NY.
Oktay, S., 1982, “Departure From Natural Convection (DNC) in Low-Temperature Boiling Heat Transfer Encountered in Cooling Microelectronic Devices,” Proceedings of the 7th International Heat Transfer Conference, 4 , Hemisphere Publishing, NY, pp. 113–118.
Nakayama, W., Nakajima, T., and Hirasawa, S., 1984, “Heat Sink Studs Having Enhanced Boiling Surfaces For Cooling Microelectronic Components,” ASME Paper No. 84-WA/HT-89.
Mudawar,  I., and Anderson,  T. M., 1993, “Optimization of Enhanced Surfaces for High Flux Chip Cooling by Pool Boiling,” ASME J. Electron. Packag., 115, pp. 89–100.
Nakayama,  W., Daikoku,  T., and Nakajima,  T., 1982, “Effects of Pore Diameters and System Pressure on Saturated Pool Nucleate Boiling Heat Transfer from Porous Surfaces,” ASME J. Heat Transfer, 104, pp. 286–291.
Nakayama,  W., Daikoku,  T., Kuwahara,  H., and Nakajima,  T., 1980, “Dynamic Model of Enhanced Boiling Heat Transfer on Porous Surfaces, Part I: Experimental Investigation,” ASME J. Heat Transfer, 102, pp. 445–450.
Arshad, J., and Thome, J. R., 1983, “Enhanced Boiling Surfaces: Heat Transfer Mechanism and Mixture Boiling,” Proceedings of ASME-JSME Thermal Engineering Joint Conference, 1 , ASME Publications, New York, NY, pp. 191–917.
Ma, T., Liu, X., Wu, J., and Li, H., 1986, “Effects of Geometrical Shapes and Parameters of Re-entrant Grooves on Nucleate Pool Boiling Heat Transfer From Porous Surfaces,” Proceedings of the 8th International Heat Transfer Conference, 4 , Hemisphere Publishing, NY, pp. 2013–2018.
Chien,  L.-H., and Webb,  R. L., 1998, “A Parametric Study of Nucleate Boiling on Structured Surfaces, Part II: Effect of Pore Diameter and Pore Pitch,” ASME J. Heat Transfer, 120, pp. 1049–1054.
Ramaswamy,  C., Joshi,  Y., Nakayama,  W., and Johnson,  W. B., 1999, “Compact Thermosyphons Employing Microfabricated Components,” Microscale Thermophys. Eng., 3(4), pp. 273–282.
Ramaswamy, C., 1999, “A Compact Two-Phase Thermosyphon Employing Microfabricated Boiling Enhancement Structures,” Ph.D. dissertation, University of Maryland at College Park, MD.
Kline,  S. J., and McClintock,  F. A., 1953, “Describing Uncertainties in Single Sample Experiments,” Mech. Eng. (Am. Soc. Mech. Eng.), 75, pp. 3–8.
Nakayama, W., Nakajima, T., Ohashi, S., and Kuwahara, H., 1989, “Modeling of Temperature Transient of Microporous Studs in Boiling Dielectric Fluid After Stepwise Power Application,” Heat Transfer in Electronics, R. K. Shah, ed., ASME HTD—Vol. 111, ASME, New York, pp. 17–23.

Figures

Grahic Jump Location
Enhanced structure in electronics cooling, using FC-72 as the working fluid
Grahic Jump Location
Cross-sectional view of structures used by authors for parametric study
Grahic Jump Location
Enhanced structures employed in this study (silicon and copper)
Grahic Jump Location
(a) Schematic of the thermosyphon loop; and (b) detailed view of the evaporator
Grahic Jump Location
Effect of pore size on boiling heat transfer (Pp=0.7 mm)
Grahic Jump Location
Possible modes of boiling (Nakayama et al., 6)
Grahic Jump Location
Effect of pore pitch on boiling heat transfer (Dp=0.15 mm)
Grahic Jump Location
Effect of varying stack height (Hs) on boiling heat transfer (for ‘C-0.2-0.5’)
Grahic Jump Location
Liquid and vapor distribution in the channels (a) single layer structure; and (b) two-layer structure

Tables

Errata

Discussions

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In