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TECHNICAL PAPERS: Heat Transfer Enhancement

Effects of Varying Geometrical Parameters on Boiling From Microfabricated Enhanced Structures

[+] Author and Article Information
C. Ramaswamy

IBM Corporation, Hopewell Junction, NY 12533

Y. Joshi

G. W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA 30332

W. Nakayama

ThermTech International, Kanagawa, Japan 255-0004

W. B. Johnson

Laboratory for Physical Sciences, College Park, MD 20740

J. Heat Transfer 125(1), 103-109 (Jan 29, 2003) (7 pages) doi:10.1115/1.1513575 History: Received May 02, 2001; Revised June 11, 2002; Online January 29, 2003
Copyright © 2003 by ASME
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References

Figures

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Enhanced structure in electronics cooling, using FC-72 as the working fluid
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Cross-sectional view of structures used by authors for parametric study
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Enhanced structures employed in this study (silicon and copper)
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(a) Schematic of the thermosyphon loop; and (b) detailed view of the evaporator
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Effect of pore size on boiling heat transfer (Pp=0.7 mm)
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Possible modes of boiling (Nakayama et al., 6)
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Effect of pore pitch on boiling heat transfer (Dp=0.15 mm)
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Effect of varying stack height (Hs) on boiling heat transfer (for ‘C-0.2-0.5’)
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Liquid and vapor distribution in the channels (a) single layer structure; and (b) two-layer structure

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