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TECHNICAL PAPERS: Microscale Heat Transfer

An Improved Computational Procedure for Sub-Micron Heat Conduction

[+] Author and Article Information
J. Y. Murthy

School of Mechanical Engineering, Purdue University, West Lafayette, IN 47907

S. R. Mathur

Fluent Inc., 10 Cavendish Court, Lebanon, NH 03766

J. Heat Transfer 125(5), 904-910 (Sep 23, 2003) (7 pages) doi:10.1115/1.1603775 History: Received June 26, 2002; Revised June 04, 2003; Online September 23, 2003
Copyright © 2003 by ASME
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References

Figures

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Finite volume scheme: temperature variation at three different time instants for β=0
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Finite volume scheme: intensity variation at three different time instants in the direction s=0.231i+0.189j+0.952k for β=0
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Finite volume scheme: temperature variation for different acoustic thicknesses at t*=0.5
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Decomposition A: temperature variation for β=0 at t*=0.1, 0.5 and 1.0 for Nθ×Nϕ=4×4 and nθ×nϕ=20×20
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Decomposition A: temperature variation for β=0.1 at t*=0.5 for various control angles and pixelations
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Decomposition A: temperature variation for β=10.0 at t*=0.5 for various control angles and pixelations
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Decomposition A: temperature variation for various acoustic thicknesses at t*=0.5 for Nθ×Nϕ=2×2 and nθ×nϕ=5×5
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Decomposition B: temperature variation for β=0.1 and 10.0 at t*=0.5 for various control angles and pixelations
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Temperature variation for β=10 at t*=0.5 for Nθ×Nϕ=8×8. The modified schemes employs a pixelation of nθ×nϕ=20×20
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Decomposition B: temperature variation for various acoustic thicknesses at t*=0.5 for Nθ×Nϕ=2×2 and Nθ×nϕ=5×5

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