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TECHNICAL PAPERS: Thermal Systems

Thermal Resistance of Particle Laden Polymeric Thermal Interface Materials

[+] Author and Article Information
Ravi S. Prasher, Jim Shipley, Suzana Prstic, Paul Koning, Jin-lin Wang

Ch5-157, Intel Corporation, 5000 W. Chandler Blvd., Chandler, AZ 85226-3699

J. Heat Transfer 125(6), 1170-1177 (Nov 19, 2003) (8 pages) doi:10.1115/1.1621893 History: Received December 23, 2002; Revised June 27, 2003; Online November 19, 2003
Copyright © 2003 by ASME
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References

Prasher,  R. S., 2001, “Surface Chemistry Based Model for the Thermal Contact Resistance of Fluidic Interstitial Thermal Interface Materials,” ASME J. Heat Transfer, 123, pp. 969–975.
Gwinn, J. P., and Webb, R. L., 2002, “Performance and Testing of Thermal Interface Materials,” Thermes 2002, Y. K. Joshi and S. V. Garimella, eds., Santa Fe, New Mexico, 13–16 January.
Suddith,  R. D., 1993, “A Generalized Model to Predict the Viscosity of Solutions With Suspended Particles. 1,” J. Appl. Polym. Sci., 48, pp. 25–36.
Xu,  Y., Luo,  X., and Chung,  D. D. L., 2000, “Sodium Silicate Based Thermal Interface Material for High Thermal Contact Conductance,” ASME J. Electron. Packag., 122, pp. 128–131.
Prasher, R. S., Koning, P., Shipley, J., and Devpura, A., 2001, “Dependence of Thermal Conductivity and Mechanical Rigidity of Particle-Laden Polymeric. Thermal Interface Material on Particle Volume Fraction,” Proc. of International Mech. Eng. Cong. and Exp., New York, Nov. 11–16.
Prasher,  R. S., Koning,  P., Shipley,  J., and Devpura,  A., 2003, “Dependence of Thermal Conductivity and Mechanical Rigidity of Particle-Laden Polymeric Thermal Interface Material on Particle Volume Fraction,” ASME J. Electron. Packag., 125(3), pp. 386–391.
Madhusudana, C. V., 1996, Thermal Contact Conductance, Springer-Verlag, New York.
Das,  A. K., and Sadhal,  S. S., 1998, “Analytical Solution For Constriction Resistance With Interstitial Fluid,” Heat Mass Transfer, 34, pp. 111–119.
Zhou, P., and Goodson, K. E., 2001, “Modeling and Measurement of Pressure Dependent Junction-Spreader Thermal Resistance for Integrated Circuits,” Proc. of International Mech. Eng. Cong. and Exp., ASME, New York.
Campbell, R. C., Smith, S. E., and Dietz, R. L., 1999, “Measurements of Adhesive Bondline Effective Thermal Conductivity and Thermal Resistance Using the Laser Flash Method,” Proceedings of 15th IEEE SEMI-THERM Symposium, IEEE, Piscataway, NJ, pp. 83–97.
Fletcher, L. S., and Peterson, G. P., 1986, “The Effect of Interstitial Materials on the Thermal Contact Conductance of Metallic Junctions,” Heat Transfer in Systems Seminar-Phase II, National Cheng University, Tainan, January 13–14.
Shenoy, A. V., 1999, Rheology of Filled Polymer System, Kluwer Academic Publishers, MA, pp. 1–390.
Devpura,  A., Phelan,  P. E., and Prasher,  R. S., 2001, “Size Effects on the Thermal Conductivity of Polymers Laden With Highly Conductive Filler Particles,” Microscale Thermophys. Eng., 5(3), pp. 177–189.
Barnes,  H. A., 1999, “The Yield Stress—A review or ‘παϖταρελ’—Everything Flows,” J. Non-Newtonian Fluid Mech., 81, pp. 133–178.
Prasher, R. S., Shipley, J. C., Prstic, S., Koning, P., and Wang, J., 2002, “Rheological Study of Micro Particle Laden Polymeric Thermal Interface Materials: Experimental (Part 1) and Modeling (Part 2),” Proc. of International Mechanical Engineering Congress and Exposition, ASME, New York.
Dienes,  G. J., and Klemm,  H. F., 1946, “Theory and Application of the Parallel Plate Plastometer,” J. Appl. Phys., 17, pp. 458–471.
Grimm,  R. J., 1978, “Squeezing Flows of Polymeric Liquids,” AIChE J., 24(3), pp. 427–439.
Covey,  G. H., and Stanmore,  B. R., 1981, “Use of the Parallel-Plate Plastometer for the Characterization of Viscous Fluids With a Yield Stress,” J. Non-Newtonian Fluid Mech., 8, pp. 249–260.
Campanella,  O. H., and Peleg,  M., 1987, “Determination of Yield Stress of Semiliquid Foods From Squeezing Flow Data,” J. Food. Sci., 52(1), pp. 214–217.
Meeten,  G. H., 2000, “Yield Stress of Structured Fluids Measured by Squeeze Flow,” Rheol. Acta, 39, pp. 399–408.
Delhaye,  N., Poitou,  A., and Chaouche,  M., 2000, “Squeeze Flow of Highly Concentrated Suspensions of Spheres,” J. Non-Newtonian Fluid Mech., 94, pp. 67–74.
Buscall,  R., Mcgown,  I. J., Mills,  P. D. A., Stewart,  R. F., Sutton,  D., White,  L. R., and Yates,  G. E., 1987, “The Rheology of Strongly Flocculated Suspensions,” J. Non-Newtonian Fluid Mech., 24, pp. 183–202.
Progelhof,  R. C., Thrones,  J. L., and Ruetsch,  R. R., 1976, “Methods for Predicting the Thermal Conductivity of Composite Systems: A Review,” Polym. Eng. Sci., 16(9), pp. 615–624.
Hassleman,  D. P. H., and Johnson,  L. F., 1987, “Effective Thermal Conductivity of Composites With Interfacial Thermal Barrier Resistance,” J. Compos. Mater., 21, pp. 508–515.
Devpura, A, Phelan, P. E., and Prasher, R. S., 1999, “Percolation Theory Applied to the Analysis of Thermal Interface Materials in Flip-Chip Technology,” Proc. of ITHERM, Las Vegas.
Every,  A. G., Tzou,  Y., Hassleman,  D. P. H., and Raj,  R., 1992, “The Effect of Particle Size on the Thermal Conductivity of ZnS/Diamond Composites,” Acta Metall. Mater., 40(1), pp. 123–129.
Prasher, R. S., Alger, O., and Phelan, P. E., 2001, “A Unified Macroscopic and Microscopic Approach to Contact Conduction Heat Transfer,” Proc. of 35th National Heat Transfer Conference, Anaheim, CA.

Figures

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Schematic of various resistance components of a TIM
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Viscosity versus strain rate for silicone A
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Viscosity versus shear stress to obtain yield stress of silicone A
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Experimental apparatus for the measurement of BLT and k
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BLT versus pressure for silicone A
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BLT versus p/τy for various TIM
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Thermal conductivity of silicone A sample
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Modeling results of thermal resistance versus particle volume fraction
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Experimental results for resistance versus particle volume fraction

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