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TECHNICAL PAPERS: Heat Transfer in Manufacturing

Thermal and Thermomechanical Phenomena in Picosecond Laser Copper Interaction

[+] Author and Article Information
Xinwei Wang

Department of Mechanical Engineering, N104 Walter Scott Engineering Center, The University of Nebraska at Lincoln, Lincoln, Nebraska 68588-0656

J. Heat Transfer 126(3), 355-364 (Jun 16, 2004) (10 pages) doi:10.1115/1.1725092 History: Received March 31, 2003; Revised January 21, 2004; Online June 16, 2004
Copyright © 2004 by ASME
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References

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Ohmura, E., Fukumoto, I., and Miyamoto, I., 1999, “Modified Molecular Dynamics Simulation on Ultrafast Laser Ablation of Metal,” presented at the International Congress on Applications of Lasers and Electro-Optics, Laser Institute of America, Orlando, pp. 219–228.
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Figures

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Schematic of the computational domain
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The temperature distribution of lattice at different times. Solid line: numerical computation using the finite difference method; dots: MD simulation.
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The temperature distribution of electrons at different times. Solid line: numerical computation using the finite difference method; dots: MD simulation.
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Velocity distribution in comparison with the Maxwellian distribution at different locations during laser heating (t=10 ps). The temperature shown in the figure is the local temperature used for calculating the Maxwellian distribution. Dots: MD simulation; solid line: Maxwellian distribution.
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Velocity distribution in comparison with the Maxwellian distribution at different locations after laser heating (t=50 ps). The temperature shown in the figure is the local temperature used for calculating the Maxwellian distribution. Dots: MD simulation; solid line: Maxwellian distribution.
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Number density distribution in space at different times
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In-plane radial distribution function at different locations for t=20 ps
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Stress distribution in space at different times
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Snapshot of atomic positions in the space of 0<x<16 nm,7.37<y<8.87 nm, and 0<z<150 nm. The horizontal white lines mark the approximate position of the solid-liquid interface.

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