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TECHNICAL NOTES

Analysis of Madejski Splat-Quench Solidification Model With Modified Initial Conditions

[+] Author and Article Information
D. Sivakumar, H. Nishiyama

Electromagnetic Intelligent Fluids Laboratory, Institute of Fluid Science, Tohoku University, 2-1-1 Katahira, Aoba-ku, Sendai 980-8577, Japan

J. Heat Transfer 126(3), 485-489 (Jun 16, 2004) (5 pages) doi:10.1115/1.1738421 History: Received July 16, 2003; Revised November 20, 2003; Online June 16, 2004
Copyright © 2004 by ASME
Topics: Solidification
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References

Figures

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Schematic sketch showing the parameters used in Madejski 13 model
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Comparison of the model predictions on the evolution of the spreading droplet radius (R) for the impact of an ink droplet with D=2.96 mm and W=1.36 m/s (Re=4000 and We=72)
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Comparison of the model predictions on the evolution of the spreading droplet radius (R) for the impact of a water droplet with D=3.7 mm and W=1.48 m/s (Re=6980 and We=114). The experimentally measured value of the dynamic contact angle, θ=49° is used for the present calculations.
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Comparison of the model predictions on the evolution of the droplet spreading radius (R) with solidification for a molten solder droplet of D=81.4 μm and W=1.52 m/s impinging on a substrate with To=135°C
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Present model predictions on the variation of the maximum spreading droplet radius with St for the impact of molten solder droplets with D=81.4 μm and W=1.52 m/s

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