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TECHNICAL NOTES

Analysis of Madejski Splat-Quench Solidification Model With Modified Initial Conditions

[+] Author and Article Information
D. Sivakumar, H. Nishiyama

Electromagnetic Intelligent Fluids Laboratory, Institute of Fluid Science, Tohoku University, 2-1-1 Katahira, Aoba-ku, Sendai 980-8577, Japan

J. Heat Transfer 126(3), 485-489 (Jun 16, 2004) (5 pages) doi:10.1115/1.1738421 History: Received July 16, 2003; Revised November 20, 2003; Online June 16, 2004
Copyright © 2004 by ASME
Topics: Solidification
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References

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Figures

Grahic Jump Location
Schematic sketch showing the parameters used in Madejski 13 model
Grahic Jump Location
Comparison of the model predictions on the evolution of the spreading droplet radius (R) for the impact of an ink droplet with D=2.96 mm and W=1.36 m/s (Re=4000 and We=72)
Grahic Jump Location
Comparison of the model predictions on the evolution of the spreading droplet radius (R) for the impact of a water droplet with D=3.7 mm and W=1.48 m/s (Re=6980 and We=114). The experimentally measured value of the dynamic contact angle, θ=49° is used for the present calculations.
Grahic Jump Location
Comparison of the model predictions on the evolution of the droplet spreading radius (R) with solidification for a molten solder droplet of D=81.4 μm and W=1.52 m/s impinging on a substrate with To=135°C
Grahic Jump Location
Present model predictions on the variation of the maximum spreading droplet radius with St for the impact of molten solder droplets with D=81.4 μm and W=1.52 m/s

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