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TECHNICAL NOTES

Numerical and Experimental Investigations of Melting and Solidification Processes of High Melting Point PCM in a Cylindrical Enclosure

[+] Author and Article Information
Ahmed Elgafy, Osama Mesalhy

University of Dayton Research Institute, 300 College Park, Dayton, OH 45469, USA

Khalid Lafdi

University of Dayton Research Institute, 300 College Park, Dayton, OH 45469, USAAFRL/MLBC, WPAFB, OH 45433, USA

J. Heat Transfer 126(5), 869-875 (Nov 16, 2004) (7 pages) doi:10.1115/1.1800492 History: Received August 19, 2003; Revised May 05, 2004; Online November 16, 2004
Copyright © 2004 by ASME
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References

Figures

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Physical domain and boundary conditions
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Control volume around node P
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Verification of the present model with Zivkovic and Fujii findings 9
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Temperature and liquid fraction contours during heating process
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Temperature time history for heating process at z=0.5 L and r=0.6 R
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Temperature and liquid fraction contours during cooling process
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Temperature time history for cooling process at z=0.5 L and r=0.6 R
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Rate of heat release during cooling process
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The output power realized during the solidification process from utilized PCM of present work and from utilized PCM of 9
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Variation of temperature at the center of the test enclosure with time during the melting process of the utilized PCM
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Variation of temperature at the center of the test enclosure with time during the solidification process of the utilized PCM

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