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TECHNICAL NOTES

Numerical and Experimental Investigations of Melting and Solidification Processes of High Melting Point PCM in a Cylindrical Enclosure

[+] Author and Article Information
Ahmed Elgafy, Osama Mesalhy

University of Dayton Research Institute, 300 College Park, Dayton, OH 45469, USA

Khalid Lafdi

University of Dayton Research Institute, 300 College Park, Dayton, OH 45469, USAAFRL/MLBC, WPAFB, OH 45433, USA

J. Heat Transfer 126(5), 869-875 (Nov 16, 2004) (7 pages) doi:10.1115/1.1800492 History: Received August 19, 2003; Revised May 05, 2004; Online November 16, 2004
Copyright © 2004 by ASME
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References

Harris,  K. T., Haji-Sheikh,  A., and Agwu Nnanna,  A. G., 2001, “Phase-Change Phenomena in Porous Media—A Non-Local Thermal Equilibrium Model,” Int. J. Heat Mass Transfer, 44, pp. 1619-1625.
Crank, J., 1984, Free and Moving Boundary Problems, Claredon Press, Oxford.
Voller,  V. R., Swaminathan,  C. R., and Thoma,  B. G., 1990, “Fixed Grid Techniques for Phase Change Problems: Review,” Int. J. Numer. Methods Eng., 30, pp. 875–898.
Voller,  V. R., 1990, “Fast Implicit Finite-Difference Method for the Analysis of Phase Change Problem,” Numer. Heat Transfer, Part B, 17, pp. 155–169.
Shamsunder,  N., and Sparrow,  E. M., 1975, “Analysis of Multi-Dimensional Conduction Phase Change via the Enthalpy Model,” ASME J. Heat Transfer, 97, pp. 330–340.
Furzeland,  R. M., 1980, “A Comparative Study of Numerical Methods for Moving Boundary Problems,” J. Inst. Math. Appl., 19, pp. 411–429.
Ghasemi,  B., and Molki,  M., 1999, “Melting of Unfixed Solids in Square Cavities,” Int. J. Heat Fluid Flow, 20, pp. 446–452.
Asako,  Y., Faghri,  M., Charmchi,  M., Bahrami,  P. A., 1994, “Numerical Solution for Melting of Unfixed Rectangular Phase-Change Material Under Low-Gravity Environment,” Numer. Heat Transfer, Part A, 25, pp. 191–208.
Zivkovic,  B., and Fujii,  I., 2001, “An Analysis of Isothermal Phase Change of Phase Change Material Within Rectangular and Cylindrical Containers,” Sol. Energy, 70(1), pp. 51–61.
Rady,  M. A., and Mohanty,  A. K., 1996, “Natural Convection During Melting and Solidification of Pure Metals in a Cavity,” Numer. Heat Transfer, Part A, 29, pp. 49–63.
Lacroix,  M., 1993, “Numerical Simulation of a Shell-and-Tube Latent Heat Thermal Energy Storage Unit,” Sol. Energy, 50(4), pp. 357–367.
Patrick,  B., and Lacroix,  M., 1998, “Numerical Simulation of a Multi-Layer Latent Heat Thermal Energy Storage System,” Int. J. Energy Res., 22, pp. 1–15.
Kurklu,  A., Wheldon,  A., and Hadley,  P., 1996, “Mathematical Modeling of the Thermal Performance of a Phase-Change Material (PCM) Store: Cooling Cycle,” Journal of Applied Thermal Engineering, 16(7), pp. 613–623.
Jianfeg,  W., Ouyang,  Y., and Chen,  G., 2001, “Experimental Study of Charging Process of a Cylindrical Heat Storage Capsule Employing Multiple-Phase-Change Materials,” Int. J. Energy Res., 25, pp. 439–447.
Casano,  G., and Piva,  S., 2002, “Experimental and Numerical Investigation of the Steady Periodic Solid-Liquid Phase-Change Heat Transfer,” Int. J. Heat Mass Transfer, 45, pp. 4181–4190.
Incropera, F. P., and Dewitt, D. P., 2001, Fundamentals of Heat and Mass Transfer, fourth ed., Wiley, New York.

Figures

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Physical domain and boundary conditions
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Control volume around node P
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Verification of the present model with Zivkovic and Fujii findings 9
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Temperature and liquid fraction contours during heating process
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Temperature time history for heating process at z=0.5 L and r=0.6 R
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Temperature and liquid fraction contours during cooling process
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Temperature time history for cooling process at z=0.5 L and r=0.6 R
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Rate of heat release during cooling process
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The output power realized during the solidification process from utilized PCM of present work and from utilized PCM of 9
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Variation of temperature at the center of the test enclosure with time during the melting process of the utilized PCM
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Variation of temperature at the center of the test enclosure with time during the solidification process of the utilized PCM

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