0
Article

Next Generation Devices for Electronic Cooling With Heat Rejection to Air

[+] Author and Article Information
Ralph L. Webb

Penn State University, University Park, PA 16802

J. Heat Transfer 127(1), 2-10 (Feb 15, 2005) (9 pages) doi:10.1115/1.1800512 History: Received April 12, 2004; Revised July 06, 2004; Online February 15, 2005
Copyright © 2005 by ASME
Your Session has timed out. Please sign back in to continue.

References

Figures

Grahic Jump Location
Schematic of remotely located thermosyphon heat rejection device
Grahic Jump Location
Air cooled heat sink with fan
Grahic Jump Location
Tree of methods of removing heat from hot source surface
Grahic Jump Location
Boiling performance of water at Tsat=65°C on 0.5 mm thick porous boiling surfaces. P-1 (100-200 μm), P-2 (50-100 μm), P-3 (30-50 μm), from Chien and Chang 5.
Grahic Jump Location
Spray cooling concepts: (a) Single nozzle used by Marcos et al. 8, and (b) Multiple nozzle with piezo-electric vibrator sued by Xia 9.
Grahic Jump Location
Boiling heat flux versus superheat for four different micro-nozzle plates, from Xia 9.
Grahic Jump Location
Vibration induced droplet atomization (VIDA) boiling device. (a) Cross-section schematic with air cooling fins on outer cylinder walls, and (b) Illustration of droplets formed at multiple orifice plate. From Heffington 11.
Grahic Jump Location
Schematic of a microchannel heat sink from Koo et al. 12.
Grahic Jump Location
Air-cooled thermo-syphon and tube cross-section (16 mm tube depth) from Webb and Yamauchi 4
Grahic Jump Location
Air-cooled thermo-syphon and tube cross-section (16 mm tube depth) from Webb and Yamauchi 4
Grahic Jump Location
A schematic of a high performance IndHR ambient heat exchanger for a two CPU system from Webb and Yamauchi 4

Tables

Errata

Discussions

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In