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Article

Next Generation Devices for Electronic Cooling With Heat Rejection to Air

[+] Author and Article Information
Ralph L. Webb

Penn State University, University Park, PA 16802

J. Heat Transfer 127(1), 2-10 (Feb 15, 2005) (9 pages) doi:10.1115/1.1800512 History: Received April 12, 2004; Revised July 06, 2004; Online February 15, 2005
Copyright © 2005 by ASME
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References

Saini, M., and Webb, R. L., 2002, “Heat Rejection Limits of Air Cooled Plane Fin Heat for Computer Cooling,” Proc. ITherm 2002, 8thIntersociety Conf. On Thermal and Thermomechanical Phenomena in Electronic Systems, May 30-Jun 1, San Diego, CA, pp. 1–8.
Saini, M., and Webb, R. L., 2002, “Validation of Models for Air Cooled Plane Fin Heat Sinks Used in Computer Cooling,” Proc. ITherm 2002, 8thIntersociety Conf. On Thermal and Thermomechanical Phenomena in Electronic Systems, May 30-Jun 1, San Diego, CA, pp. 243–250.
Webb, R. L., 1994. Principles of Enhanced Heat Transfer, John Wiley & Sons, New York.
Webb, R. L., and Yamauchi, S., 2002. “Remote Heat Sink Concept for High Power Heat Rejection,” in THERMES 2002, Thermal Challenges in Next Generation Electronic Systems; eds. Y. Joshi and S. Garimella, Millpress, Rotterdam, pp. 201–210, 2002 (Also published in IEEE Trans. Components and Materials Packaging, Vol. 25, pp. 608–614, 2002).
Chien, L.-H., and Chang, C.-C., 2002. “Experimental Study of Evaporation Resistances on Porous Surfaces in Flat Heat Pipes,” Proc. ITherm 2002, 8thIntersociety Conf. On Thermal and Thermomechanical Phenomena in Electronic Systems, May 30-Jun 1, San Diego, CA, pp. 236–242.
Cooper,  M. G., 1984, “Saturation Nucleate, Pool Boiling—A Simple Correlation,” Int. J. Heat Mass Transfer, 23, pp. 73–87.
Pais,  M. R., Chow,  L. C., and Mahefkey,  E. T., 1992, “Surface Roughness and its Effects on the Heat Transfer Mechanism in Spray Cooling,” ASME J. Heat Transfer, 114, pp. 211–219.
Marcos, A., Chow, L. C., Du, J., Lei, S., Rini, D. P., and Lindauer, J. J., 2002, “Spray Cooling at Low System Pressure,” 18thIEEE SEMI-THERM Symposium, pp. 169–175.
Xia, Chunlin, 2002, “Spray/Jet Cooling for Heat Flux High to 1 kW/cm2,” 18thIEEE SEMI-THERM Symposium, pp. 159–163.
Murthy, J. Y., Amon, C. H., Gabriel, K., Kumta, P., and Yao, S. C., 2001, “MEMS-Based Thermal Management of Electronics Using Spray Impingement,” Proc. of IPACK’01, July 8–13, 2001, Kauai, Hawaii, Paper IPACK2001-15567.
Heffington, S. N., 2001, “Vibration-Induced Droplet Atomization Heat Transfer Cell for Cooling of Microelectronic Components,” Proc. of IPACK’01, Paper IPACK2001-15596.
Koo, J. M., Jiang, L., Zhang, L., Zhou, P., Banerjee, S. S., Kenny, T. W., Santiago, J. G., and Goodson, K. E., 2000, “Modeling of Two-Phase Microchannel Heat Sinks for VLSI Chips,” Proc. of the14thAnnual IEEE International MEMS-01 conference, Interlaken, Switzerland, pp. 422–426.
Jiang, L., Koo, J. M., Zeng, S., Mikkelsen, J. C., Zhang, L., Zhou, P., Santiago, J. G., Kenny, T. W., Goodson, K. E., Maveety, J. G., and Tran, Q. A., 2001, “Two-Phase Microchannel Heat Sinks for an Electrokinetic VLSI Chip Cooling System,” Proc. of the17thIEEE SEMI-THERM Symposium, March 20-22, 2001, San Jose, CA, pp. 153–157.
Perret,  C., Boussey,  J., Schaeffer,  C., and Coyaud,  M., 2000, “Analytic Modeling, Optimization, and Realization of Cooling Devices in Silicon Technology,” IEEE Transactions on Components and Packaging Technologies, 23(4), pp. 665–672.
Hestroni,  G., Mosyak,  A., Segal,  Z., and Zisking,  G., 2002, “A Uniform Heat Sink for Cooling of Electronic Devices,” Int. J. Heat Mass Transfer, 45, pp. 3275–3286.
Zhang, L., Wang, E., Koo, J., Jiang, L., Goodson, K., Santiago, J., and Kenny, T., 2002, “Enhanced Nucleate Boiling in Microchannels,” Proc.15thInt’l. Conf. on Micro Electro Mechanical Systems MEMS 2002, Las Vegas, NV, pp 89–92.
Webb, R. L., 2003, “Effect of Manifold Design on Flow Distribution in Parallel Micro-Channels,” Paper 35251, IPack ’03, Maui, HI, July 2003.
Webb, R. L., Chang, Y., and Wang, C., 1995. “Heat Transfer and Friction Correlations for the Louver Fin Geometry,” 1995 Vehicle Thermal Management Systems Conference Proceedings, SAE, pp. 533–541.
Chang,  Y.-J., and Wang,  C.-C., 1997, “A Generalized Heat Transfer Correlation for Louver Fin Geometry,” Int. J. Heat Mass Transfer, 40, pp, 533–544.

Figures

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Schematic of remotely located thermosyphon heat rejection device
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Air cooled heat sink with fan
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Tree of methods of removing heat from hot source surface
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Boiling performance of water at Tsat=65°C on 0.5 mm thick porous boiling surfaces. P-1 (100-200 μm), P-2 (50-100 μm), P-3 (30-50 μm), from Chien and Chang 5.
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Spray cooling concepts: (a) Single nozzle used by Marcos et al. 8, and (b) Multiple nozzle with piezo-electric vibrator sued by Xia 9.
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Boiling heat flux versus superheat for four different micro-nozzle plates, from Xia 9.
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Vibration induced droplet atomization (VIDA) boiling device. (a) Cross-section schematic with air cooling fins on outer cylinder walls, and (b) Illustration of droplets formed at multiple orifice plate. From Heffington 11.
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Schematic of a microchannel heat sink from Koo et al. 12.
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Air-cooled thermo-syphon and tube cross-section (16 mm tube depth) from Webb and Yamauchi 4
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Air-cooled thermo-syphon and tube cross-section (16 mm tube depth) from Webb and Yamauchi 4
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A schematic of a high performance IndHR ambient heat exchanger for a two CPU system from Webb and Yamauchi 4

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