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Article

Thermal Design of an Airborne Computer Chassis With Air-Cooled, Cast Pin Fin Coldwalls

[+] Author and Article Information
Donald C. Price

Raytheon Co., McKinney, Texas, 75071e-mail: dprice@raytheon.com

B. Elliott Short

Raytheon Co., McKinney, Texas, 75071e-mail: eshort@raytheon.com

J. Heat Transfer 127(1), 11-17 (Feb 15, 2005) (7 pages) doi:10.1115/1.1839583 History: Received April 30, 2004; Revised August 13, 2004; Online February 15, 2005
Copyright © 2005 by ASME
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References

Short,  B. E., Raad,  P. E., and Price,  D. C., 2002, “Performance of Pin Fin Cast Aluminum Coldwalls: Part 1—Friction Factor Correlations,” J. Thermophys. Heat Transfer, 16, No. 3, pp. 389–396.
Short,  B. E., Raad,  P. E., and Price,  D. C., 2002, “Performance of Pin Fin Cast Aluminum Coldwalls: Part 2—Friction Factor Correlations,” J. Thermophys. Heat Transfer, 16, No. 3, pp. 397–403.
Short, B. E., Jr., Price, D. C., and Raad, P. E., 2003, “Design of Cast Pin Fin Coldwalls for Air-Cooled Electronic Systems,” Paper No. InterPACK2003-35004, Proceedings of InterPACK’03, ASME International Electronic Packaging Technical Conference and Exhibition, Maui, Hawaii, 6–11 July, 2003.
Short,  B. E., Price,  D. C., and Raad,  P. E., 2004, “Design of Cast Pin Fin Coldwalls for Air-Cooled Electronic Systems,” ASME J. Electron. Packag., 126, pp. 67–73.
MSC.Patran, MSC Software Corporation, 2 MacArthur Place, Santa Ana, CA, 92707, USA, 714-540-8900, http://mscsoftware.com
Maya TMG-Thermal, Maya Heat Transfer Technologies Ltd., 4999 St. Catherine St. West, Suite 400, Montreal, Quebec, Canada, H3Z 1T3, 514-369-5706, http://www.mayahtt.com
Howden Group Limited, Old Govan Road, Renfrew, Renfrewshire, PA4 8XJ, United Kingdom, Telephone: +44 141 885 7300, http://www.howden.com
Gebert,  G. G., “How Altitude Affects Forced Air Cooling Requirements of Electronic Equipment,” AMETEK Rotron, Mil-Aero Products, 9 Hasbrouck Lane, Woodstock, NY 12498, http://rotron.com/
Harvard Thermal TAS Version 7.0 (Thermal Analysis System) and Harvard Thermal TASPCB (Printed Circuit Board Modeler/Solver), Harvard Thermal Inc., Harvard, MA, 20002, http://www.harvardthermal.com/

Figures

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Full length side view of electronics pod indicating five different bays
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Isometric view of bays #1 and #2 from both the starboard side and port side of the pod showing location of antenna and electronic boxes
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Transparent skin, isometric view of bay #5 showing ECS and ram air inlet with diffuser
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Schematic showing thermal management concept for air-cooled electronics located in bays #1 and #2
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System response curves for two candidate pin fin coldwall cores superimposed on fan performance curves showing fan operating points as a function of altitude
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Finite-element model of computer chassis including top and bottom coldwalls and PWB card slots
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Color contour plot of finite-element model of computer chassis using pin fin core #2 evaluated at sea level flight altitude
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Color contour plot of model of front side of typical PWB in computer chassis using pin fin coldwall #2 evaluated at sea level flight altitude
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Color contour plot of model of back side of typical PWB in computer chassis using pin fin coldwall #2 evaluated at sea level flight altitude
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Photograph of air-cooled computer chassis
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Exploded view of air-cooled computer chassis showing inlet air plenum, PWB card guides, and pin fin coldwalls
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Drawing of pin fin coldwall configuration indicating pin height and pin spacings

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