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Article

A Multi-Grid Based Multi-Scale Thermal Analysis Approach for Combined Mixed Convection, Conduction, and Radiation Due to Discrete Heating

[+] Author and Article Information
Lan Tang

Carnegie Mellon University, Pittsburgh, PA 15213

Yogendra K. Joshi

The George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA 30332

J. Heat Transfer 127(1), 18-26 (Feb 15, 2005) (9 pages) doi:10.1115/1.1852495 History: Received April 19, 2004; Revised September 12, 2004; Online February 15, 2005
Copyright © 2005 by ASME
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References

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Figures

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Multi-scale thermal modeling: bridging the gap between system and board/component modeling
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Wind tunnel and the rest of the test facility
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(a) Computational domain for system level modeling (b) Test board with 9 PQFPs surface mounted and the block on lead model (all dimensions in cm)
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PQFP and the detailed dimension for component level modeling (All dimensions in mm)
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Velocity vectors and temperature contours for Q=0.5 W, at z=10.03 cm: (a) U=0.43 m/s,(u2+v2)max=0.526 m/s,Tmax=64.8°C; and (b) U=0.99 m/s,(u2+v2)max=1.21 m/s,Tmax=53.7°C
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Energy budget for nominal Qi =1.0 W: (a) radiation effect, (b) convection effect, and (c) percentage of heat dissipation from package top surface
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Comparison of junction temperature between measured and published in literature for component 5
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Comparison of junction temperature from multi-scale thermal analysis with experimental measurement: (a) Uref=0.61 (0.43 for Qi =0.5 W) m/s; (b) Uref=0.99 m/s; and (c) Uref=1.49 m/s

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