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Article

A Comparative Study of Cooling of High Power Density Electronics Using Sprays and Microjets

[+] Author and Article Information
Matteo Fabbri, Shanjuan Jiang, Vijay K. Dhir

Mechanical and Aerospace Engineering Department, Henry Samueli School of Engineering and Applied Science, University of California Los Angeles, 420 Westwood Plaza, Los Angeles, CA 90095

J. Heat Transfer 127(1), 38-48 (Feb 15, 2005) (11 pages) doi:10.1115/1.1804205 History: Received May 12, 2004; Revised July 24, 2004; Online February 15, 2005
Copyright © 2005 by ASME
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Figures

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Schematic of the experimental setup
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Details of the test section
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HAGO nozzle and spray details
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Details of the diode and the jets
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Schematic of the RTDs placement
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Comparison of spray data for two flowrates (a) 50.56 ml/min [2.87 μl/mm2  s] and (b) 81.56 ml/min [4.63 μl/mm2  s], with the predictions of Holman et al. 1213 and Cho et al. 15
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Comparison between spray and micro jets performance for two flowrates (a) 50.56 ml/min [2.87 μl/mm2  s] and (b) 81.56 ml/min [4.63 μl/mm2  s]
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Comparison of process efficiency between spray and micro jets for two flowrates (a) 50.56 ml/min [2.87 μl/mm2  s] and (b) 81.56 ml/min [4.63 μl/mm2  s]
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Comparison between spray and micro jets performance for the same pumping power
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Comparison of the present data with the results by Oliphant et al. 8
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Cooling module test results (4×6 array of jets, dn=140 μm,s=2 mm): heat flux as a function of Tchip−Tliq
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Heat flux as a function of wall superheat
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Equivalent thermal circuit for the cooling module
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Cooling module test results: external resistance versus air flowrate
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Cooling module test results

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