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Article

Integrated Microchannel Cooling for Three-Dimensional Electronic Circuit Architectures

[+] Author and Article Information
Jae-Mo Koo, Linan Jiang, Kenneth E. Goodson

Mechanical Engineering Department, Stanford University, Stanford, CA 94305

Sungjun Im

Materials Science and Engineering Department, Stanford University, Stanford, CA 94305

J. Heat Transfer 127(1), 49-58 (Feb 15, 2005) (10 pages) doi:10.1115/1.1839582 History: Received April 23, 2004; Revised September 11, 2004; Online February 15, 2005
Copyright © 2005 by ASME
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References

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Figures

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Three-dimensional circuit architecture connected to a conventional heat removal device
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Conceptual schematic of a microchannel cooling network for a 3D circuit and the thermal circuit model. (a) 3D circuit with a microchannel cooling system. (b) Thermal circuit for microchannel cooling.
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Schematic of hierarchical 3D circuit structures fabricated by (a) wafer bonding, and (b) silicon epitaxial growth or recrystallization of polysilicon
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Schematic of microchannels implemented in a 3D circuit and thermal modeling of microchannel cooling for a 3D circuit. Only one channel is analyzed in a cooling layer by geometric and thermal symmetries. Dotted lines indicate a control volume used in derivation of energy equations [Eqs. (1) and (2)]. (a) Schematic of microchannel cooling for a 3D circuit. (b) Thermal circuit of the jth microchannel.
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Predictions for the effective thermal conductance and thermal resistance. (a) Effective conduction area and effective solid conductivity in the z direction. (b) Conduction thermal resistance between device layers.
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Flowchart showing the calculation procedure used in this study
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Two-layer 3D circuit layouts for evaluating the performance of microchannel cooling. The areas occupied by memory and logic are the same and the logic disssipates 90% of the total power consumption 53.
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Comparison of junction temperatures in a two-layer stacked circuit for the cases of an integrated microchannel heat sink and a conventional heat sink. The total flow rate of the liquid water is 15 ml/min and the mass flux is 1.36×10−5 kg/s.

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