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Article

Heat Transfer in Water-Cooled Silicon Carbide Milli-Channel Heat Sinks for High Power Electronic Applications

[+] Author and Article Information
C. Bower, A. Ortega, P. Skandakumaran

Department of Aerospace and Mechanical Engineering, The University of Arizona, Tucson, AZ 85721

R. Vaidyanathan, T. Phillips

Advanced Ceramics Research, Inc., 3292 E. Hemisphere Loop, Tucson, AZ 85706-5013

J. Heat Transfer 127(1), 59-65 (Feb 15, 2005) (7 pages) doi:10.1115/1.1852494 History: Received May 25, 2004; Revised September 01, 2004; Online February 15, 2005
Copyright © 2005 by ASME
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References

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Figures

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Schematic of a representative sample
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Schematic of sample manifold and instrumentation
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Comparison of thermal resistance for SiC and copper heat exchangers and high-performance air sink
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Single-row samples compared to laminar heat transfer theory for a single isothermal circular channel
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Wetted Nusselt number dependence on number of rows
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Effect of increasing number of rows and flow rate on thermal resistance
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Nusselt number based on base area for 4 and 7 row samples
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Pressure drop as a function of mass flow and channel diameter for samples of similar cross-sectional area
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Friction factor for the copper validation sample compared to theory
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Friction factor for a single-row SiC sample compared to theory
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Friction factors of several SiC samples compared to theory

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