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Article

Microelectromechanical System-Based Evaporative Thermal Management of High Heat Flux Electronics

[+] Author and Article Information
Cristina H. Amon, S.-C. Yao, C.-F. Wu, C.-C. Hsieh

Mechanical Engineering Department, Institute for Complex Engineered Systems, Carnegie Mellon University, 5000 Forbes Avenue, Pittsburgh, PA 15213

J. Heat Transfer 127(1), 66-75 (Feb 15, 2005) (10 pages) doi:10.1115/1.1839586 History: Received May 14, 2004; Revised August 13, 2004; Online February 15, 2005
Copyright © 2005 by ASME
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References

Park, K. A., and Bergles, A. E., 1986, “Boiling Heat Transfer Characteristics of Simulated Microelectronic Chips with Detachable Heat Sinks,” Proc. 8th International Heat Transfer Conference, Hemisphere Publishing Co., Washington, DC, 4 , pp. 2099–2104.
Park,  K. A., and Bergles,  A. E., 1988, “Effects of Size of Simulated Microelectronic Chips on Boiling and Critical Heat Flux,” J. Heat Transfer, 10, pp. 728–734.
Bergles, A. E., and Kim, C. J., 1988, “A Method to Reduce Temperature Overshoots in Immersion Cooling of Electronic Devices,” Proc. InterSociety Conference on Thermal Phenomena in the Fabrication and Operation of Electronic Components, IEEE, New York, NY, pp. 100–105.
Carvalho, R. D. M., and Bergles, A. E., 1990, “The Influence of Subcooling on the Pool Nucleate Boiling and Critical Heat Flux of Simulated Electronic Chips,” Proc. 9th International Heat Transfer Conference, Hemisphere Publishing Co., New York, NY, pp. 289–294.
Park, K. A., Bergles, A. E., and Danielson, R. D., 1990, “Boiling Heat Transfer Characteristics of Simulated Microelectronic Chips with Fluorinert Liquids,” Heat Transfer in Electronic and Microelectronic Equipment, Bergles, A. E. ed., Hemisphere Publishing Co., New York, NY, pp. 573–588.
Bergles, A. E., and Bar-Cohen, A., 1990, “Direct Liquid Cooling of Microelectronic Components,” Advances in Thermal Modeling of Electronic Components and Systems, Kraus, A. D. ed., ASME Press, NY, pp. 233–250.
Ma, C. F., and Bergles, A. E., 1983, “Boiling Jet Impingement Cooling of Simulated Microelectronic Chips Heat Transfer in Electronic Equipment,” Proc. Heat Transfer in Electronic Equipment, ASME, HTD-28 , pp. 5–12.
Golobic, I., and Bergles, A. E., 1992, “Effects of Thermal Properties and Thickness of Horizontal Vertically Oriented Ribbon Heaters on the Pool Boiling Critical Heat Flux,” Proc. Engineering Foundation Conference on Pool and External Flow Boiling, ASME, pp. 213–218.
Zitz, J. A., and Bergles, A. E., 1993, “Immersion Cooling of a Multichip Module by Pool Boiling of FC-86,” Proc. ASME International Electronics Packaging Conference, ASME, pp. 917–926.
Incropera, F. P., 1990, “Liquid Immersion Cooling of Electronic Components,” Heat Transfer in Electronic and Microelectronic Equipment, Bergles, A. E. ed., Hemisphere Publishing Co., New York, NY, pp. 407–444.
Bar-Cohen,  A., 1993, “Thermal Management of Electronic Components with Dielectric Liquids,” Int. J. JSME, 36(1), pp. 1–25.
Peterson, G. P., 1994, An Introduction to Heat Pipes, Wiley, New York, NY.
Haider,  S. I., Joshi,  Y. K., and Nakayama,  W., 2002, “A Natural Circulation Model of the Closed Loop, Two-Phase Thermosyphon for Electronics Cooling,” J. Heat Transfer, 124(5), pp. 881–890.
Palm, B., and Tengblad, N., 1996, “Cooling of Electronics by Heat Pipes and Thermosyphons-A Review of Methods and Possibilities,” Proc. 31st National Heat Transfer Conference, ASME, HTD-329 , pp. 97–108.
Tuckerman,  D. B., and Pease,  R. F. W., 1981, “High-Performance Heat Sinking for VLSI,” IEEE Electron Device Lett., EDL-2(5), pp. 126–129.
Bower,  M. B., and Mudawar,  I., 1994, “High Flux Boiling in Low Flow Rate, Low Pressure Drop Mini-Channel and Micro-Channel Heat Sinks,” Int. J. Heat Mass Transfer, 37(2), pp. 321–332.
Knight,  R. W., Hall,  D. J., Goodling,  J. S., and Jaeger,  R. C., 1992, “Heat Sink Optimization with Application to Microchannels,” IEEE Trans. Compon., Hybrids, Manuf. Technol., 15, pp. 832–842.
Qu,  W., and Mudawar,  I., 2002, “Experimental and Numerical Study of Pressure Drop and Heat Transfer in Single-Phase Micro-channel Heat Sink,” Int. J. Heat Mass Transfer, 45(12), pp. 2549–2565.
Bergles,  A. E., Lienhard,  V. J. H., Kendall,  G. E., and Griffith,  P., 2003, “Boiling and Evaporation in Small Diameter Channels,” Heat Transfer Eng., 24(1), pp. 18–40.
Peng,  X. F., and Wang,  B. X., 1993, “Forced-Flow Convection and Flow Boiling Heat Transfer for Liquid Flowing Through Microchannels,” Int. J. Heat Mass Transfer, 36(14), pp. 3421–3427.
Stevens,  J., and Webb,  B. W., 1989, “Local Heat Transfer Coefficients Under an Axisymmetric, Single-phase Liquid Jet,” J. Heat Transfer, 113(1), pp. 71–78.
Womac, D. J., Aharoni, G., Ramadhyani, S., and Incropera, F. P., 1990, “Single-phase Liquid Jet Impingement Cooling of Small Heat Sources, Heat Transfer,” Proc. International Heat Transfer Conference, pp. 149–154.
Womac,  D. J., Ramadhyani,  S., and Incropera,  F. P., 1993, “Correlating Equations for Impingement Cooling of Small Heat Sources with Single Circular Liquid Jets,” J. Heat Transfer, 115(1), pp. 106–115.
Womac,  D. J., Incropera,  F. P., and Ramadhyani,  S., 1994, “Correlating Equations for Impingement Cooling of Small Heat Sources with Multiple Circular Liquid Jets,” J. Heat Transfer, 116(2), pp. 482–486.
Maddox,  D. E., and Bar-Cohen,  A., 1994, “Thermofluid Design of Single-phase Submerged Jet Impingement Cooling for Electronic Components,” J. Electron. Packag., 116(3), pp. 237–240.
Martin,  H., 1977, “Heat and Mass Transfer Between Impinging Gas Jets and Solid Surfaces,” Adv. Heat Transfer, pp. 1–60.
Wadsworth,  D. C., and Mudawar,  I., 1990, “Cooling of a Multichip Electronic Module by Means of Confined Two-dimensional Jets of Dielectric Liquid,” J. Heat Transfer, 112(4), pp. 891–898.
Zumbrunnen,  D. A., and Aziz,  M., 1993, “Convective Heat Transfer Enhancement Due to Intermittency in an Impinging Jet,” J. Heat Transfer, 115(1), pp. 91–98.
Liu, X., and Lienhard, J. H., 1989, “Liquid Jet Impingement Heat Transfer on a Uniform Flux Surface, Heat Transfer Phenomena in Radiation,” Proc. Heat Transfer Phenomena in Radiation, Combustion, and Fires, ASME, HTD-106 , pp. 523–530.
Liu,  X., Lienhard,  J. H., and Lombara,  J. S., 1991, “Convective Heat Transfer by Impingement of Circular Liquid Jets,” J. Heat Transfer, 113(3), pp. 571–581.
Liu,  X., Gabour,  L. A., and Lienhard,  J. H., 1993, “Stagnation Point Heat Transfer During Liquid Jet Impingement: Analysis with Surface Tension,” J. Heat Transfer, 115(1), pp. 99–105.
Nonn, T., Dagan, Z., and Jiji, L. M., 1989, “Jet Impingement Flow Boiling of a Mixture of FC-72 and FC-87 Liquids on a Simulated Electronic Chip,” Proc. Heat Transfer in Electronics of National Heat Transfer Conference, ASME, HTD-111 , pp. 121–128.
Nakayama,  W., and Copeland,  D., 1994, “Heat Transfer from Chips to Dielectric Coolant: Enhanced Pool Boiling Versus Jet Impingement Cooling,” J. Enhanced Heat Transfer, 1(3), pp. 231–243.
Copeland,  D., 1998, “Single-phase and Boiling Cooling of a Small Heat Source by Multiple Nozzle Jet Impingement,” Int. J. Heat Mass Transfer, 39(7), pp. 1395–1406.
Ma,  C. F., Gan,  Y. P., Tian,  Y. C., Lei,  D. H., and Gomi,  T., 1993, “Liquid Jet Impingement Heat Transfer With or Without Boiling,” J. Therm. Sci., 2(1), pp. 32–49.
Wang, D., Yu, E., and Przekwas, A., 1999, “A Computational Study of Two-phase Jet Impingement Cooling of an Electronic Chip,” Proc. 15th Annual IEEE Semiconductor Thermal Measurement and Management Symposium, IEEE, New York, pp. 10–15.
Ravigururajan,  T. S., and Bergles,  A. E., 1994, “Visualization of Flow Phenomena Near Enhanced Surfaces,” J. Heat Transfer, 116(1), pp. 54–57.
Reid,  R. S., Pate,  M. B., and Bergles,  A. E., 1991, “A Comparison of Augmentation Techniques During In-tube Evaporation of R-113,” J. Heat Transfer, 113(2), pp. 451–458.
Thome, J. R., 1990, Enhanced Boiling Heat Transfer, Hemisphere Publishing Co., New York, NY.
Web, R. L., 1994, Principles of Enhanced Heat Transfer, Wiley, New York, NY.
Nakayama,  W., Daikoku,  T., Kuwahara,  H., and Nakajima,  T., 1980, “Dynamic Model of Enhancement Boiling Heat Transfer on Porous Surfaces, Part I: Experimental Investigation,” J. Heat Transfer, 102(3), pp. 445–450.
Nakayama,  W., Nakajima,  T., and Hirasawa,  S., 1984, “Heat Sink Studs Having Enhanced Boiling Surfaces for Cooling Microelectronic Components,” ASME, 84-WA/HT-89.
Miller, W. J., 1991, “Boiling and Visualization from Microconfigured Surfaces,” M.S. thesis, Univ. of Pennsylvania, Philadelphia, PA.
Bhavnani,  S. H., Tsai,  C. P., Jaeger,  R. C., and Eison,  D. L., 1993, “An Integral Heat Sink for Cooling Microelectronic Components,” J. Electron. Packag., 115(3), pp. 284–291.
Sullivan, J., Ramadhyani, S., and Incropera, F. P., 1992, “Use of Smooth and Roughened Spreader Plates to Enhance Impingement Cooling of Small Heat Sources with Single Circular Jets,” Proc. 28th National Heat Transfer Conference and Exhibition, ASME, HTD-206 (2), pp. 103–110.
Teuscher, K. L., Ramadhyani, S., and Incropera, F. P., 1993, “Jet Impingement Cooling of an Array of Discrete Heat Sources with Extended Surfaces,” Proc. Enhanced Cooling Techniques for Electronics Applications, ASME, HTD-263 , pp. 1–10.
Wadsworth,  D. C., and Mudawar,  I., 1992, “Enhancement of Single-phase Heat Transfer and Critical Heat Flux from an Ultra-high-flux Simulated Microelectronic Heat Source to a Rectangular Impinging Jet of Dielectric Liquid,” J. Heat Transfer, 114(3), pp. 764–768.
Yao, S. C., Deb, S., and Hammouda, N., 1989, “Impact Spray Boiling for Thermal Control of Electronic Systems,” Proc. Heat Transfer in Electronics of National Heat Transfer Conference, ASME, HTD-111 , pp. 129–133.
Pais,  M. R., Chow,  L. C., and Mahefkey,  E. T., 1992, “Surface Roughness and its Effects on the Heat Transfer Mechanism in Spray Cooling,” J. Heat Transfer, 114(1), pp. 211–219.
Sehmbey,  M. S., Pais,  M. R., and Chow,  L. C., 1992, “Effect of Surface Material Properties and Surface Characteristics in Evaporative Spray Cooling,” J. Thermophys. Heat Transfer, 6(3), pp. 505–512.
Estes,  K. A., and Mudawar,  I., 1995, “Comparison of Two-Phase Electronic Cooling Using Free Jets and Sprays,” J. Electron. Packag., 117, pp. 323–332.
Amon,  C. H., Murthy,  J. Y., Yao,  S. C., Narumanchi,  S., Wu,  C. F., and Hsieh,  C. C., 2001, “MEMS-Enabled Thermal Management of High-Heat-Flux Devices, Edifice: Embedded Droplet Impingement for Integrated Cooling of Electronics,” J. Exp. Thermal Fluid Sci., 25(5), pp. 231–242.
Kim,  J. H., You,  S. M., Stephen,  U. S., and Choi,  U. S., 2004, “Evaporative Spray Cooling of Plain and Microporous Coated Surface,” Int. J. Heat Mass Transfer, 47(14–16), pp. 3307–3315.
Cho, C. S. K., and Wu, K., 1988, “Comparison of Burnout Characteristics in Jet Impingement Cooling and Spray Cooling,” Proc. 1988 National Heat Transfer Conference, ASME, HTD-96 , pp. 561–567.
Toda,  S., 1974, “A Study of Mist Cooling (2nd Report: Theory of Mist Cooling and its Fundamental Experiments),” Heat Transfer-Jpn. Res., 3(1), pp. 1–44.
Fedder,  G. K., Santhanam,  S., Reed,  M. L., Eagle,  S. C., Guillou,  D. F., Lu,  M. S.-C., and Carley,  L. R., 1996, “Laminated High-Aspect-Ratio Microstructures in a Conventional CMOS Process,” Sens. Actuators, A, 57(2), pp. 103–110.
Murthy, J. Y., Amon, C. H., Gabriel, K., Kumta, P., Yao, S. C., Boyalakuntla, D., Hsieh, C. C., Jain, A., Narumanchi, S. V. J., Rebello, K., and Wu, C. F., 2001, “MEMS-based Thermal Management of Electronics Using Spray Impingement,” Proc. Pacific Rim/International, Intersociety Electronic Packaging Technical/Business Conference and Exhibition, ASME, pp. 1–12.
Narumanchi,  S. V. J., Amon,  C. H., and Murthy,  J. Y., 2003, “Influcence of Pulsating Submerged Liquid Jets on Chip-Level Thermal Phenomena,” ASME J. Electron. Packag. 125(3), pp. 354–361.
Yao, S. C., Amon, C. H., Gabriel, K., Kumta, P., Murthy, J. Y., Wu, C. F., Hsieh, C. C., Boyalakuntla, D., Narumanchi, S. V. J., and Rebello, K., 2001, “MEMS-Enabled Micro Spray Cooling System for Thermal Control of Electronic Chips,” Proc. ASME International Mechanical Engineering Congress and Exposition, HTD-369 (7), pp. 181–192.
Wu, C. F., and Yao, S. C., 2001, “Breakup of Liquid Jets from Irregular Shaped Silicon Micro Nozzles,” Proc. 4th Int. Conf. on Multiphase Flow.
Wu,  C. F., Erdmann,  L., Gabriel,  K., and Yao,  S. C., 2001, “Fabrication of Silicon Sidewall Profiles for Fluidic Applications Using Modified Advanced Silicon Etching,” Proc. MEMS Design, Fabrication, Characterization, and Packaging, Proc. SPIE, 4407, pp. 100–108.
Leoni,  N., and Amon,  C. H., 1997, “Transient Thermal Design of Wearable Computers with Embedded Electronics Using Phase Change Materials,” ASME, HTD-343(5), pp. 49–56.
Vesligaj,  M., and Amon,  C. H., 1999, “Transient Thermal Management of Temperature Fluctuations during Time Varying Workloads on Portable Electronics,” IEEE Trans. Compon. Packag. Technol., 22(4), pp. 541–550.
Alawadhi, E. M., and Amon, C. H., 2000, “Performance Analysis of an Enhanced PCM Thermal Control Unit,” Proc. 7th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, 1 , pp. 283–289.
Leoni,  N., and Amon,  C. H., 2000, “Bayesian Surrogates for Integrating Numerical, Analytical and Experimental Data: Application to Inverse Heat Transfer in Wearable Computers,” IEEE Trans. Compo. Packag. Manuf. Technol., 23(1), pp. 23–32.

Figures

Grahic Jump Location
HFE jet breakup length (L/d) of area-equivalent diameter of 100 μm nozzles of axisymmetric shapes. The inset shows a typical liquid jet atomization curve
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Effect of nozzle shapes (a) same hydraulic diameter of 100 μm, 16.0 psig injection pressure, and (b) same hydraulic diameter of 150 μm, 13.1 psig injection pressure
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Effect of swirling for same hydraulic diameter of 150 μm. Injection pressure is 15.3 psig
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Effect of vapor flow on multiple jets and droplets in the vapor chamber
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Schematic of the prototype notebook PC evaporative spray cooling system. Inset shows a swirl silicon nozzle.
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Performance of the prototype notebook PC evaporative spray cooling system using silicon swiss-roll micronozzles
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Surface texture schematics and images of silicon microstructured surfaces
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Heat transfer results of different surface textures with up-facing surface
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Schematic of EDIFICE and overall system
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Schematics of the test bed
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Nozzle orifice shapes. (a) Circle, (b) square, (c) triangle, (d) medal, (e) cross, (f ) star, (g) V-shaped, (h) H-shaped, (i) I-shaped, (j) cantilever-short, (k) cantilever-median, (l) cantilever-long, (m) rectangle-long, (n) rectangle-median, (o) rectangle-short, (p) dumbbell-long, (q) dumbbell-median and (r) dumbbell-short
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(a) Inlet chip, and (b) swirl chip

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