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Article

An Assessment of Module Cooling Enhancement With Thermoelectric Coolers

[+] Author and Article Information
R. E. Simons, M. J. Ellsworth, R. C. Chu

International Business Machines, Poughkeepsie, NY 12601

J. Heat Transfer 127(1), 76-84 (Feb 15, 2005) (9 pages) doi:10.1115/1.1852496 History: Received April 19, 2004; Revised November 03, 2004; Online February 15, 2005
Copyright © 2005 by ASME
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Figures

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History of room temperature thermoelectric figure of merit (ZT) adapted from 16
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Cooling power density for different T.E. cooler designs (adapted from Vandersande and Fleurial 10)
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Structure for a thin film thermoelectric device (adapted from Fleurial and Vandersande 10)
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Simplified cross-sectional view of a central processor module level package with thermal grease conduction paths
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Cross-section view of chip site on MCM showing thermal resistances w/ and w/o thermoelectric cooler augmentation
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Module temperature reduction versus module power for air or water-cooled 126 mm×126 mm multi-chip
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Comparison of allowable module heat load with and without thermoelectric cooling enhancement
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Effect of increased thermoelectric ZT on maximum allowable module power
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Variation in module Q max with thermal conductivity of TE elements for a Seebeck coefficient=0.0002 and ZT=0.8
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Variation in maximum allowable module power with thermal conductivity of TE elements for different different values of Seebeck coefficient for ZT=3.0
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Theoretical module power limit versus chip temperature for ZTs based upon optimal combination of thermoelectric element electrical resistivity and thermal conductivity
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Effect of external thermal resistance on theoretical module power limit for ZTs based on optimal combination of thermoelectric element electrical resistivity and thermal conductivity
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Thermoelectric module (a) plan view with top substrate removed and (b) side view
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Thermoelectric module geometry scaled from a thermoelectric element length of 3.07 mm to 0.12 mm
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Electronics module cooling capability when a thermoelectric module is included and its geometry is scaled
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Thermoelectric module coefficient of performance (COP) corresponding to module heat removal capability in Fig. 15

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