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Article

An Assessment of Module Cooling Enhancement With Thermoelectric Coolers

[+] Author and Article Information
R. E. Simons, M. J. Ellsworth, R. C. Chu

International Business Machines, Poughkeepsie, NY 12601

J. Heat Transfer 127(1), 76-84 (Feb 15, 2005) (9 pages) doi:10.1115/1.1852496 History: Received April 19, 2004; Revised November 03, 2004; Online February 15, 2005
Copyright © 2005 by ASME
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References

Gaensslen, F. H., 1980, “MOS Devices and Integrated Circuits at Liquid Nitrogen Temperature,” 1980 IEEE ICCD Proceedings, pp. 450–452.
Jaeger, R. C., 1986, “Development of Low Temperature CMOS for High Performance Computer Systems,” IEEE International Conference on Computer Design: VLSI in Computers, pp. 128–130.
Kirschmann, R. K., 1986, “Development of Low Temperature CMOS for High Performance Computer Systems,” IEEE International Conference on Computer Design: VLSI in Computers, pp. 128–130.
Krane, R. J., Bar-Cohen, A., Jaeger, R. C., and Gaensslen, F. H., 1990, “MOS Electronics and Thermal Control for Cryogenically-Cooled Computer Systems,” in Advances in Thermal Modeling of Electronic Components and Systems, 2 , ASME Press, New York, NY, pp. 185–232.
Taur, Y., and Nowak, E. J., 1997, “CMOS Devices Below 0.1 μm: How High Will Performance Go?,” Electron Devices Meeting Technical Digest, IEEE, Piscataway, NJ, pp. 215–218.
Nolas, G. S., Slack, G. A., Cohn, J. L., and Schujman, S. B., 1998, “The Next Generation of Thermoelectric Materials,” Proceedings of the 17th International Conference on Thermoelectrics, IEEE, Piscataway, NJ, pp. 294–297.
Kraus, A. D., 1965, Cooling Electronic Equipment, Prentice-Hall, New York, NY.
Dubois, L. H., 1999, “An Introduction to the DARPA Program in Advanced Thermoelectric Materials and Devices,” Proceedings of 18th International Conference on Thermoelectrics, IEEE, Piscataway, NJ, pp. 1–4.
Kolander, W. L., and Lyon, H. B., 1996, “Thermoelectric Cooler Utility for Electronic Applications,” ASME HTD-Vol. 239, National Heat Transfer Conference, 7 , ASME, New York.
Vandersande, J. W., and Fleurial, J.-P., “Thermal Management of Power Electronics Using Thermoelectric Coolers,” Proceedings of the 15th International Conference on Thermoelectrics, IEEE, Piscataway, NJ, pp. 252–255.
Stockholm, J. G., 1997, “Current State of Peltier Cooling,” Proceedings of the 16th International Conference on Thermoelectrics, pp. 37–46.
Fleurial, J.-P., Borshchevsky, A., Caillat, T., and Ewell, R., 1997, “New Materials and Devices for Thermoelectric Applications,” IECEC, ACS Paper No. 97419, pp. 1080–1085.
Dresselhaus, M. S., Koga, T., Sun, X., Cronin, S. B., Wang, Cronin, S. B., Wang, K. L., and Chen, G., 1997, “Low Dimensional Thermoelectrics,” Proceedings of the 16th International Conference on Thermoelectrics, IEEE, Piscataway, NJ, pp. 12–20.
Morelli, D. T., 1996, “Potential Applications of Advanced Thermoelectrics in the Automobile Industry,” Proceedings of the 13th International Conference on Thermoelectrics, pp. 383–386.
Chu, R. C., and Simons, R. E., 1994, “Cooling Technology for High Performance Computers: Design Applications,” in Cooling of Electronic Systems, S. Kakac, H. Yuncu, and K. Hijikata, eds., Kluwer Academic Publishers, Dordrecht, Netherlands, pp. 71–95.
Phelan, P. E., Chiriac, V., and Lee, T.-Y., 1996, “Current and Future Miniature Refrigeration Cooling Technologies for High Power Microelectronics,” Proceedings of the 17th Semiconductor Thermal Measurement and Management Symposium, IEEE, Piscataway, NJ, pp. 158–167.

Figures

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Cooling power density for different T.E. cooler designs (adapted from Vandersande and Fleurial 10)
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Structure for a thin film thermoelectric device (adapted from Fleurial and Vandersande 10)
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Simplified cross-sectional view of a central processor module level package with thermal grease conduction paths
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Cross-section view of chip site on MCM showing thermal resistances w/ and w/o thermoelectric cooler augmentation
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Module temperature reduction versus module power for air or water-cooled 126 mm×126 mm multi-chip
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Comparison of allowable module heat load with and without thermoelectric cooling enhancement
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Effect of increased thermoelectric ZT on maximum allowable module power
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Variation in module Q max with thermal conductivity of TE elements for a Seebeck coefficient=0.0002 and ZT=0.8
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Variation in maximum allowable module power with thermal conductivity of TE elements for different different values of Seebeck coefficient for ZT=3.0
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Theoretical module power limit versus chip temperature for ZTs based upon optimal combination of thermoelectric element electrical resistivity and thermal conductivity
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Effect of external thermal resistance on theoretical module power limit for ZTs based on optimal combination of thermoelectric element electrical resistivity and thermal conductivity
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Thermoelectric module (a) plan view with top substrate removed and (b) side view
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Thermoelectric module geometry scaled from a thermoelectric element length of 3.07 mm to 0.12 mm
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Electronics module cooling capability when a thermoelectric module is included and its geometry is scaled
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Thermoelectric module coefficient of performance (COP) corresponding to module heat removal capability in Fig. 15
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History of room temperature thermoelectric figure of merit (ZT) adapted from 16

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