On the Nature of Critical Heat Flux in Microchannels

[+] Author and Article Information
A. E. Bergles

Mechanical Engineering Department, Massachusetts Institute of Technology, Cambridge, MA 02139 e-mail: abergles@aol.com

S. G. Kandlikar

Mechanical Engineering Department, Rochester Institute of Technology, Rochester, NY 14623 e-mail: sgkeme@rit.edu

J. Heat Transfer 127(1), 101-107 (Feb 15, 2005) (7 pages) doi:10.1115/1.1839587 History: Received May 20, 2004; Revised September 22, 2004; Online February 15, 2005
Copyright © 2005 by ASME
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Chip with integral cooling channels (see Ref. 4)
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(A) Test-section cross section, (B) Assembly used for local temperature and heat flux measurements in a PFC simulation (see Ref. 16)
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Critical power dependence on total volumetric flow rate (see Ref. 12)
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Sketch of vapor backflow near CHF (see Ref. 26); considered here to be onset of excursive instability
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Flow-rate dependence of subcooled boiling pressure drop for water, used to illustrate excursive instability (see Ref. 29)
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Predictions and data for the pressure drop in a single microchannel (see Ref. 19)




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