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RESEARCH PAPER

Investigation of a Novel Flat Heat Pipe

[+] Author and Article Information
Yaxiong Wang

Foxconn Thermal Technology, Austin, TX 78758

G. P. Peterson

Department of Mechanical, Aerospace and Nuclear Engineering, Rensselaer Polytechnic Institute, Troy, NY 12180

J. Heat Transfer 127(2), 165-170 (Mar 15, 2005) (6 pages) doi:10.1115/1.1842789 History: Received February 05, 2004; Revised May 10, 2004; Online March 15, 2005
Copyright © 2005 by ASME
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References

Plesch, D., Bier, W., Seidel, D., and Schubert, K., 1991, “Miniature Heat Pipes for Heat Removal from Microelectronic Circuits,” Proceedings of ASME Annual Meeting, Atlanta, GA.
Hopkins,  R., Faghri,  A., and Khrustalev,  D., 1999, “Flat Miniature Heat Pipes With Micro Capillary Grooves,” ASME J. Heat Transfer, 121, pp. 102–109.
Peterson,  G. P., Duncan,  A. B., and Weichold,  M. H., 1993, “Experimental Investigation of Micro Heat Pipe Fabricated in Silicon Wafers,” ASME J. Heat Transfer, 11, pp. 751–756.
Peterson, G. P., 1994, An Introduction to Heat Pipes—Modeling, Testing, and Applications, John Wiley & Sons Inc., New York.
Faghri, A., Heat Pipe Science and Technology, Taylor & Francis, PA, 1995, pp. 240–245.
Wang, Y. X., and Peterson, G. P., 2003, “Investigation of the Heat Transfer Limits in Thin Capillary Wicks of Phase-Change Cooling Devices,” The 6th ASME–JSME Thermal Engineering Joint Conference, March 16–20, Kohala, Hawaii.
Van Ooijen, H., and Hoogendoorn, C. J., 1981, “Experimental Pressure Profiles Along the Vapor Channel of a Flat-Plate Heat Pipe,” Advances in Heat Pipe Technology, Pergamon Press, Oxford, pp. 121–129.
Mallik,  A. K., and Peterson,  G. P, 1992, “On the Use of Micro Heat Pipes As an Integral Part of Semiconductor Devices Arrays” ASME J. Electron. Packag., 114, pp. 436–442.
Mallik,  A. K., and Peterson,  G. P., 1995, “Steady-State Investigation of Vapor Deposited Micro Heat Pipe Arrays,” ASME J. Electron. Packag., 117, pp. 75–87.
Peterson,  G. P., Duncan,  A. B., and Weichold,  M. H., 1993, “Experimental Investigation of Micro Heat Pipe Fabricated in Silicon Wafers,” ASME J. Heat Transfer, 11, pp. 751–756.
Wang,  Y. X., and Peterson,  G. P., 2002, “Investigation of Wire-Bonded Micro Heat Pipes,” AIAA J., 16, pp. 346–355.
Wang, Y. X., and Peterson, G. P., 2003, “Flat Heat Pipe Cooling Devices for Laptopo/Mobile Computers,” ASME INTERPACK03 Int’l Electronic Packaging Conf. and Expo., July 6–11, Maui, Hawaii.
Bejan, A., 1985, Convection Heat Transfer, John Wiley & Sons, New York, pp. 77–82.
Shah, R. K., and Bhatti, M. S., 1987, “Laminar Convective Heat Transfer in Ducts,” Handbook of Single-Phase Convective Heat Transfer, Wiley, New York, pp. 3.45–3.70.
Wang, Y. X., and Peterson, G. P., 2002, “Investigation of htin Film Evaporation Limit in Single Screen Mesh Layer,” Proceedings of the 2002 ASME Int’l Mechanical Enr. Conf. and Expo., November 17–22, New Orleans, LA.
Cary V. P., 1992, Liquid–Vapor Phase-Change Phenomena: An Introduction to the Thermophysics of Vaporization and Condensation Process in Heat Transfer Equipment, Hemisphere Publishing Corporation, Washington, p. 140.

Figures

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Schematic of the flat heat pipe
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Schematic of the experimental setup
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Thermocouple distributions on the tested flat heat pipes
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Modeling results of the effect of mesh number on the maximum heat transport capacities of flat heat pipes
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Modeling results of the effect of the wire diameter on the maximum heat transport capacities of flat heat pipes
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Modeling results of the effect of layers of the wick on the maximum heat transport capacities of flat heat pipes
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Effect of the tilt angle on the maximum heat transport capacities of the flat heat pipes
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Modeling result of the variation of the maximum heat flux with the length of the flat heat pipes
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A comparison of the experimental and modeling results of the Prototype 1 flat heat pipe
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A comparison of the experimental and modeling results of the Prototype flat heat pipes

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