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TECHNICAL PAPERS: Radiative Heat Transfer

Measurement of Thermal Boundary Conductance of a Series of Metal-Dielectric Interfaces by the Transient Thermoreflectance Technique

[+] Author and Article Information
Robert J. Stevens

Department of Mechanical and Aerospace Engineering University of Virginia Charlottesville, VA 22904

Andrew N. Smith

Department of Mechanical Engineering United States Naval Academy Annapolis, MD 21402

Pamela M. Norris

Department of Mechanical and Aerospace Engineering University of Virginia Charlottesville, VA 22904e-mail: pamela@virginia.edu

J. Heat Transfer 127(3), 315-322 (Mar 24, 2005) (8 pages) doi:10.1115/1.1857944 History: Received December 12, 2003; Revised September 21, 2004; Online March 24, 2005
Copyright © 2005 by ASME
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References

Figures

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Modeled thermal response of 30 nm Al film on a sapphire substrate with σ=1.05×108 W/m2 K. The dotted lines are the thermal response for the same film with ±50% change in σ.
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Experimental results for 29 Pt film on Si
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Experimental results for 30 nm Cr film on Si with (a) bulk value used for ks; and (b) ks treated as a free parameter
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TBC versus the ratio of Debye temperatures of the metal film and dielectric substrate. Some data are from Stoner and Maris 11.
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Ratio of measured to theoretical DMM TBC versus the ratio of Debye temperatures of the metal film and dielectric substrate. Some data is from Stoner and Maris 11.

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