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TECHNICAL BRIEFS

Thermal Resistance of Nanowire-Plane Interfaces

[+] Author and Article Information
V. Bahadur, J. Xu, Y. Liu, T. S. Fisher

School of Mechanical Engineering and Birck Nanotechnology Center, Purdue University, West Lafayette, IN 47907

J. Heat Transfer 127(6), 664-668 (Jun 06, 2005) (5 pages) doi:10.1115/1.1865217 History: Received July 29, 2004; Revised November 24, 2004; Online June 06, 2005
Copyright © 2005 by ASME
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References

Javey,  A., Guo,  J., Wang,  Q., Lundstrom,  M., and Dai,  H., 2003, “Ballistic Carbon Nanotube Field Effect Transistors,” Nature (London), 424, pp. 654–657.
Avouris,  P., Appenzeller,  J., Martel,  J., and Wind,  S. J., 2003, “Carbon Nanotube Electronics,” Proc. IEEE, 91(11), pp. 1772–1784.
Cui,  Y., Zhong,  Z., Wang,  D., Wang,  W. U., and Lieber,  C. M., 2003, “High Performance Silicon Nanowire Field Effect Transistors,” Nano Lett., 3(2), pp. 149–152.
Lundstrom, M., 2000, Fundamentals of Carrier Transport, Cambridge University Press, Cambridge, England, Chap. 2.
Cahill,  D. G., Ford,  W. K., Goodson,  K. E., Mahan,  G. D., Majumdar,  A., Maris,  H. J., Merlin,  R., and Phillpot,  S. R., 2003, “Nanoscale Thermal Transport,” J. Appl. Phys., 93(2), pp. 793–818.
Li,  D., Wu,  Y., Kim,  P., Shi,  L., Yang,  P., and Majumdar,  A., 2003, “Thermal Conductivity of Individual Silicon Nanowires,” Appl. Phys. Lett., 83(14), pp. 2934–2936.
Mingo,  N., and Yang,  L., 2003, “Phonon Transport in Nanowires Coated With an Amorphous Material: An Atomistic Green’s Function Approach,” Phys. Rev. B, 68, 245406.
Pickett,  W. E., Feldman,  J. L., and Deppe,  J., 1996, “Thermal Transport Across Boundaries in Diamond Structure Materials,” Modell. Simul. Mater. Sci. Eng., 4(4), pp. 409–419.
Israelachvili, J. N., 1985, Intermolecular and surface forces with applications to colloidal and biological systems, Academic Press, London.
McGee,  G. E., Schankula,  M. H., and Yovanovich,  M. M., 1985, “Thermal Resistance of Cylinder-Flat Contacts: Theoretical Analysis and Experimental Verification of a Line Contact Model,” Nucl. Eng. Des., 86, pp. 369–381.
Montgomery,  S. W., Franchek,  M. A., and Goldschmidt,  V. W., 2000, “Analytical Dispersion Force Calculations for Nontraditional Geometries,” J. Colloid Interface Sci., 227, pp. 567–584.
Huxtable,  S. T., and Cahill,  D. G., 2004, “Thermal Contact Conductance of Adhered Microcantilevers,” J. Appl. Phys., 95(4), pp. 2102–2108.
Huxtable,  S. T., Cahill,  D. G., Shenogin,  S., Xue,  L., Ozisik,  R., Barone,  P., Usrey,  P., Strano,  M. S., Siddons,  G., Shim,  M., and Keblinski,  P., 2003, “Interfacial Heat Flow in Carbon Nanotube Suspensions,” Nat. Mater., 2(11), pp. 731–734.
Volz,  S. G., and Chen,  G., 1999, “Molecular Dynamics Simulation of Thermal Conductivity of Silicon Nanowires,” Appl. Phys. Lett., 75(14), pp. 2056–2058.
Maruyama,  S., and Kimura,  T., 1999, “A Study on Thermal Resistance Over a Solid-Liquid Interface by the Molecular Dynamics Method,” Therm. Sci. Eng., 7(1), pp. 63–69.
Bondi,  A., 1964, “van der Waals Volumes and Radii,” J. Phys. Chem., 68(3), pp. 441–451.
Visser,  J., 1989, “van der Waals and Other Cohesive Forces Affecting Powder Fluidization,” Powder Technol., 58, pp. 1–10.

Figures

Grahic Jump Location
Nanowire-substrate system. Elastic deformation due to van der Waals force leads to a line contact of width 2b.
Grahic Jump Location
van der Waals force per micron length for a Si nanowire resting on Si or gold substrate with air or water as the medium
Grahic Jump Location
Dimensionless contact width for a Si nanowire resting on Si or gold substrate with air or water as the medium
Grahic Jump Location
Constriction, gap, and total interface resistances for a 1 μm long Si nanowire resting on a Si substrate with air or water as the medium

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