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TECHNICAL BRIEFS

Active Thermal Control of Distributed Parameter Systems Excited at Multiple Frequencies

[+] Author and Article Information
Christoph C. Richter

Institut für Thermodynamik, Technische Universität Braunschweig, Hans-Sommer-Straße 5, 38106 Braunschweig, Germanych.richter@tu-bs.de

John H. Lienhard V

Department of Mechanical Engineering, Massachusetts Institute of Technology, 77 Massachusetts Avenue, Room 3-162, Cambridge, MA 02139-4307lienhard@mit.edu

Half the peak-to-peak amplitude.

J. Heat Transfer 128(1), 93-99 (Feb 10, 2005) (7 pages) doi:10.1115/1.2130408 History: Received August 04, 2004; Revised February 10, 2005

In testing packaged high-power integrated circuits, active thermal control is useful in providing die-level temperature stability. A time-varying heat load is applied to the surface of the package to compensate for the time-varying test power sequence applied to the die. An earlier study determined the proper control heat load for a single-frequency sinusoidal variation in die power subject to a finite allowed temperature variation on the die. Actual test power sequences contain many frequencies at various phase angles, each contributing to the temperature variation of the die. In the present study, we develop a method of controlling multiple frequency test sequences subject to a finite temperature tolerance. It is shown that the total control power may be minimized assigning temperature tolerances to the highest frequencies in the test power sequence.

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Copyright © 2006 by American Society of Mechanical Engineers
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References

Figures

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Figure 1

Typical cross section of a high-power microprocessor device

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Figure 2

Schematic diagram of simplified device for transient analysis

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Figure 3

Control power densities and phase shifts for single frequency die power profile (ω=5Hz and Qc=10W∕cm2) and multiple prescribed temperature tolerances ΔT. The problem properties are given in Tables  12. The circles 엯 mark the points computed using the method given in (4).

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Figure 4

Control power density for optimal control of a single frequency die power profile with Qd=10W∕cm2 and frequencies from zero to 50HZ

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Figure 5

Temperature and power profiles for square wave die power profile and a prescribed temperature tolerance of ΔT=2K. Properties are given in Tables  12.

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Figure 6

Temperature and power profiles for triangular wave die power profile and a prescribed temperature tolerance of ΔT=2K. Properties are given in Tables  12.

Tables

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