Thermal-Fluid MEMS Devices: A Decade of Progress and Challenges Ahead

[+] Author and Article Information
I. Hassan

Department of Mechanical and Industrial Engineering, Concordia University, Montreal, Quebec, Canada, H3G 1M8IbrahimH@alcor.concordia.ca

J. Heat Transfer 128(11), 1221-1233 (Mar 30, 2006) (13 pages) doi:10.1115/1.2352792 History: Received April 07, 2005; Revised March 30, 2006

Microdevices are becoming more prevalent and important in current and future technologies. Over the past decade, countless studies have been conducted in developing thermal microdevices. This paper focuses on the progress of research made during the last decade regarding heat transfer and fluid flow in microheat sinks, micropumps, microturbines, microengines, micromixers, as well as microsensors. Recent experimental techniques in the thermal microelectromechanical systems (MEMS) field have also been presented. Although some thermal MEMS devices have penetrated the commercial market, the mass implementation of thermal MEMS devices in future technology is still quite far, and is highly desirable. During the next decade, vast amounts of research need to be conducted before other microdevices can infiltrate the mainstream. Possible future directions of research have also been provided.

Copyright © 2006 by American Society of Mechanical Engineers
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Figure 1

Comparison of pressure drop data in microchannels from recent and earlier studies (119)

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Figure 2

A comparison of transition lines on a flow regime map plotting the superficial liquid velocity (JL) versus the superficial gas velocity (JG) from studies conducted by (1) Damianides and Westwater (11), (2) Fukano (12), (3,4) Triplett (15), (5) Kawahara (18), and (6,7) Hassan (19) in horizontal microchannels (19)

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Figure 3

Boiling characteristics in mini- and micro- channels as a function of vapor mass quality (120)

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Figure 4

Unstable boiling modes, (a) liquid/two-phase, (b) continuous two-phase, (c) liquid/two-phase vapour alternating flow (23)

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Figure 5

Comparison of several reported micropumps based on maximum flow rate Qmax, maximum pressure Δpmax, and package size Sp. Self-pumping frequency is here defined as fsp=Qmax∕Sp(42)

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Figure 6

Six-wafer microgas turbine engine (60)

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Figure 7

Microreciprocation engine proposed by Sugiyama and Toriyama (58)

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Figure 8

Microsensor for measuring wall shear stress proposed by Yoshino (74-75)

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Figure 9

Microsensor for measuring heat flux proposed by Oh (78)

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Figure 10

Typical operating ranges of passive and active micromixers (81)




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