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TECHNICAL PAPERS: Evaporation, Boiling, and Condensation

Critical Heat Flux of R-123 in Silicon-Based Microchannels

[+] Author and Article Information
Ali Koşar

Department of Mechanical, Aerospace and Nuclear Engineering, Rensselaer Polytechnic Institute, Troy, NY 12180

Yoav Peles1

Department of Mechanical, Aerospace and Nuclear Engineering, Rensselaer Polytechnic Institute, Troy, NY 12180pelesy@rpi.edu

1

Corresponding author.

J. Heat Transfer 129(7), 844-851 (Jul 10, 2006) (8 pages) doi:10.1115/1.2712852 History: Received March 01, 2006; Revised July 10, 2006

Critical heat flux (CHF) of R-123 in a silicon-based microchannel heat sink was investigated at exit pressures ranging from 227kPato520kPa. Critical heat flux data were obtained over effective heat fluxes ranging from 53Wcm2to196Wcm2 and mass fluxes from 291kgm2sto1118kgm2s. Flow images and high exit qualities suggest that dryout is the leading CHF mechanism. The effect of mass velocity, exit quality, and system pressure were also examined, and a new correlation is presented to represent the effect of these parameters.

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Copyright © 2007 by American Society of Mechanical Engineers
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Figures

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Figure 1

CAD model of the microchannel device (units in millimeters)

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Figure 3

qeff″ versus T¯ curve

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Figure 4

Annular flow patterns

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Figure 5

qCHF″ dependence on G

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Figure 6

CHF dependence on xe

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Figure 2

Experimental setup

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Figure 7

CHF dependence on pe

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Figure 8

Change in the annular flow pattern with heat flux (G=622kg∕m2s,pe=315kPa): (a) qeff″=99W∕cm2 (b) qeff″

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Figure 10

Presentation of the experimental data with dimensionless parameters

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Figure 9

Predictions of the existing correlations

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