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TECHNICAL PAPERS: Conduction

The Error Analysis of a Steady-State Thermal Conductivity Measurement Method With Single Constant Temperature Region

[+] Author and Article Information
Ming-Tsung Sun1

Department of Mechanical Engineering, Chang Gung University, 259 Wen-Hwa 1st Road, Kwei-Shan, Tao-Yuan 333, Taiwan

Chin-Hsiang Chang2

Department of Mechanical Engineering, Chang Gung University, 259 Wen-Hwa 1st Road, Kwei-Shan, Tao-Yuan 333, Taiwan

1

Corresponding author. e-mail: mtsun@mail.cgu.edu.tw

2

e-mail: changch@post.savs.ilc.edu.tw

J. Heat Transfer 129(9), 1119-1126 (Dec 14, 2006) (8 pages) doi:10.1115/1.2739585 History: Received January 10, 2006; Revised December 14, 2006

A method for steady-state thermal conductivity measurement with single constant temperature region has been developed. To better understand the accuracy of the method a numerical model is devised and verified by experimental results. The ratios of thermal conductivity derived from the temperature distribution solutions to that given in the numerical model are obtained and shown. They can be used to correct the systematic error of measurement introduced by the one-dimensional approximation. Finally, the measurement uncertainty due to misalignment of the temperature sensors and the limitation of sensing devices is also investigated. The numerical model is suitable for estimating the range of confidence in practical measurements.

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Copyright © 2007 by American Society of Mechanical Engineers
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Figures

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Figure 2

The k ratio derived from different geometric parameters.

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Figure 3

The temperature distribution on the lower temperature side of a sample.

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Figure 4

The k ratio derived without temperature distribution outside the constant temperature region.

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Figure 6

The relative uncertainty of kE caused by the uncertainties of measurement and the offset of temperature sensors in the radial direction.

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Figure 5

The relative uncertainty of kE caused by the uncertainties of measurement and the offset of temperature sensors embedded in the Teflon disk plate using both Eq. 2 (left panel) and Eq. 4 (right panel) to evaluate Tmax.

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Figure 1

The descriptive diagram of the device that measures steady-state thermal conductivity.

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