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TECHNICAL PAPERS: Porous Media

Forced Convective Heat Transfer in Parallel Flow Multilayer Microchannels

[+] Author and Article Information
M. H. Saidi1

Center of Excellence in Energy Conversion, School of Mechanical Engineering,  Sharif University of Technology, P.O. Box 11365-9567, Tehran, Iran

Reza H. Khiabani

Center of Excellence in Energy Conversion, School of Mechanical Engineering,  Sharif University of Technology, P.O. Box 11365-9567, Tehran, Iran

1

Corresponding author. E-mail: saman@sharif.edu

J. Heat Transfer 129(9), 1230-1236 (Aug 30, 2006) (7 pages) doi:10.1115/1.2739600 History: Received September 27, 2005; Revised August 30, 2006

In this paper, the effect of increasing the number of layers on improving the thermal performance of microchannel heat sinks is studied. In this way, both numerical and analytical methods are utilized. The analytical method is based on the porous medium assumption. Here, the modified Darcy equation and the energy balance equations are used. The method has led to an analytical expression presenting the average dimensionless temperature field in the multilayer microchannel heat sink. The effects of different parameters such as aspect ratio, porosity, channel width, and the solid properties on the thermal resistance are described. The results for single layer and multilayer heat sinks are compared to show the effectiveness of using multilayer microchannels.

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Copyright © 2007 by American Society of Mechanical Engineers
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Figures

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Figure 1

Schematic of a single layer microchannel

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Figure 2

Schematic of a multilayer microchannel

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Figure 3

Temperature field in x planes in the direction of channel length

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Figure 4

The effect of aspect ratio on the thermal resistance

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Figure 5

The effect of porosity on the thermal resistance

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Figure 6

The effect of channel width on the thermal resistance

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Figure 7

Effect of number of layers on thermal performance in fixed pressure drop

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Figure 8

Effect of number of layers on thermal performance in fixed pumping power

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Figure 9

Effect of solid properties on the thermal resistance of multilayer microchannel

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