0
TECHNICAL PAPERS: Evaporation, Boiling, and Condensation

Characteristics of Flow Boiling Oscillations in Silicon Microchannel Heat Sinks

[+] Author and Article Information
R. Muwanga

Department of Mechanical and Industrial Engineering, Concordia University, Montréal, QC, H3G 1M8, Canada

I. Hassan1

Department of Mechanical and Industrial Engineering, Concordia University, Montréal, QC, H3G 1M8, Canadaibrahimtt@alcor.concordia.ca

R. MacDonald2

 Washington Technology Center, Seattle, WA 98195-2140

1

Corresponding author.

2

Present address: Lund Engineering, 12600 Interurban Ave. S, Tukwilla, WA 98168.

J. Heat Transfer 129(10), 1341-1351 (Apr 13, 2007) (11 pages) doi:10.1115/1.2754946 History: Received July 18, 2006; Revised April 13, 2007

Flow boiling oscillation characteristics in two silicon microchannel heat sink configurations are presented. One is a standard heat sink with 45 straight parallel channels, whereas the second is similar except with cross-linked paths at three locations. Data are presented over a flow range of 2050mlmin(91228kg(m2s)) using distilled water as the working fluid. The heat sinks have a footprint area of 3.5cm2 and contain 269μm wide by 283μm deep reactive ion etching channels. Flow oscillations are found to be similar in characteristic trends between the two configurations, showing a decreasing frequency with increasing heat flux. The oscillation amplitudes are relatively large and identical in frequency for the inlet temperature, outlet temperature, inlet pressure, and pressure drop. Oscillation properties for the standard heat sink at two different inlet temperatures and various flow rates are correlated for different heat fluxes. This work additionally presents a first glimpse of the cross-linked heat sink performance under flow boiling instability conditions.

Copyright © 2007 by American Society of Mechanical Engineers
Your Session has timed out. Please sign back in to continue.

References

Figures

Grahic Jump Location
Figure 1

Microchannel heat sink package configuration

Grahic Jump Location
Figure 2

Microchannel heat sink fabrication process

Grahic Jump Location
Figure 4

Friction factor versus Reynolds number, cross-linked and standard heat sink

Grahic Jump Location
Figure 5

Wall temperature mapping of heat sink INT01 at Re∼307

Grahic Jump Location
Figure 7

Inlet temperature sample transient behavior, q″∼7.9W∕cm2, Tin=70°C, Qvol=30ml∕min

Grahic Jump Location
Figure 11

Inlet temperature oscillation frequency versus power for STR02 at different flow rates and inlet temperatures

Grahic Jump Location
Figure 12

Inlet temperature oscillation amplitude versus power, Tin=70°C for different heat sinks at Qvol=30ml∕min

Grahic Jump Location
Figure 13

Outlet temperature oscillation amplitude versus power, Tin=70°C for different heat sinks at Qvol=30ml∕min

Grahic Jump Location
Figure 14

Inlet pressure oscillation amplitude versus power, Tin=70°C for different heat sinks at Qvol=30ml∕min

Grahic Jump Location
Figure 15

Inlet pressure oscillation amplitude versus power for STR02 at different flow rates and inlet temperatures

Grahic Jump Location
Figure 16

Outlet temperature oscillation amplitude versus power for STR02 at different flow rates and inlet temperatures

Grahic Jump Location
Figure 10

Inlet temperature oscillation frequency versus power, Tin=70°C for different heat sinks at Qvol=30ml∕min

Grahic Jump Location
Figure 9

Inlet pressure sample transient behavior, q″∼7.9W∕cm2, Tin=70°C, Qvol=30ml∕min

Grahic Jump Location
Figure 8

Outlet temperature sample transient behavior, q″∼7.9W∕cm2, Tin=70°C, Qvol=30ml∕min

Grahic Jump Location
Figure 6

Inlet pressure versus applied power, Tin=70°C, Qvol=30ml∕min

Tables

Errata

Discussions

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In