Xin, R. C., and Tao, W. Q., 1988, “Numerical Prediction of Laminar Flow and Heat Transfer in Wavy Channels of Uniform Cross-Sectional Area,” Numer. Heat Transfer, 14 , pp. 465–481.
[CrossRef]Chen, C. K., and Cho, C. C., 2008, “A Combined Active/Passive Scheme for Enhancing the Mixing Efficiency of Microfluidic Devices,” Chem. Eng. Sci., 63 , pp. 3081–3087.
[CrossRef]Henning, T., Brandner, J. J., and Schubert, K., 2005, “High-Speed Imaging of Flow in Microchannel Array Water Evaporators,” Microfluid. Nanofluid., 1 , pp. 128–136.
[CrossRef]Kowalewski, T. A., Szumbarski, J., and Blonski, S., 2008, “Low-Reynolds-Number Instability of the Laminar Flow between Wavy Walls,” "Proceedings of the Sixth International ASME Conference on Nanochannels, Microchannels and Minichannels", Darmstadt, Germany, Jun. 23–25.
Hsieh, S. S., and Huang, Y. C., 2008, “Passive Mixing in Micro-Channels With Geometric Variations Through μPIV and μLIF Measurements,” J. Micromech. Microeng., 18 , p. 065017.
[CrossRef]Quddus, N. A., Bhattacharjee, S., and Moussa, W., 2005, “Electrokinetic Flow in a Wavy Channel,” "Proceedings of the 2005 International Conference on MEMS, NANO and Smart Systems", pp. 219–220, Alberta, Canada, Jul. 24–27.
Xia, Z., Mei, R., Sheplak, M., and Fan, Z. H., 2009, “Electroosmotically Driven Creeping Flows in a Wavy Microchannel,” Microfluid. Nanofluid., 6 , pp. 37–52.
[CrossRef]Sui, Y., Teo, C. J., Lee, P. S., Chew, Y. T., and Shu, C., 2010, “Fluid Flow and Heat Transfer in Wavy Microchannels,” Int. J. Heat Mass Transfer, 53 , pp. 2760–2772.
[CrossRef]Brunschwiler, T., Michel, B., Rothuizen, H., Kloter, U., Wunderle, B., Oppermann, H., and Reichl, H., 2008, “Forced Convective Interlayer Cooling in Vertically Integrated Packages,” "2008 Proceedings of the ITHERM", pp. 1114–1125.
Sekar, D., King, C., Dang, B., Spencer, T., Thacker, H., Joseph, P., Bakir, M., and Meindl, J., 2008, “A 3D-IC Technology With Integrated Microchannel Cooling,” "Proceedings of IEEE International Interconnect Technology Conference", pp. 13–15.
Coskun, A., Ayala, J., Atienzaz, D., and Rosingy, T., 2009, “Modeling and Dynamic Management of 3D Multicore Systems With Liquid Cooling,” "Proceedings of the 17th Annual IFIP/IEEE International Conference on Very Large Scale Integration", Brazil.
Jang, H., Yoon, I., Kim, C., Shin, S., and Chung, S., 2009, “The Impact of Liquid Cooling on 3D Multi-Core Processors,” "Proceedings of the 27th IEEE International Conference on Computer Design", Lake Tahoe, CA, Oct. 4–7.
Koo, J., Im, S., Jiang, L., and Goodson, K. E., 2005, “Integrated Microchannel Cooling for Three-Dimensional Electronic Circuit Architectures,” ASME J. Heat Transfer, 127 (1), pp. 49–58.
[CrossRef]Fluent, Inc., 2003, Fluent 6 User Manual.
Patankar, S. V., 1980, "Numerical Heat Transfer and Fluid Flow", 1st ed., Taylor & Francis, London, UK.
Gee, D. L., and Webb, R. L., 1980, “Forced Convection Heat Transfer in Helically Rib-Roughened Tubes,” Int. J. Heat Mass Transfer, 23 , pp. 1127–1136.
[CrossRef]Berger, S. A., Talbot, L., and Yao, L. -S., 1983, “Flow in Curved Pipes,” Annu. Rev. Fluid Mech., 15 , pp. 461–512.
[CrossRef]