Technical Briefs

An Experimental Study to Show the Effect of Thermal Stress on Thermal Contact Conductance at Sub-megapascal Contact Pressures

[+] Author and Article Information
Prashant Misra

Department of Instrumentation, Indian Institute of Science, Bangalore 560012, India

J. Nagaraju1

Department of Instrumentation, Indian Institute of Science, Bangalore 560012, Indiasolarjnr@isu.iisc.ernet.in


Corresponding author.

J. Heat Transfer 132(9), 094501 (Jun 29, 2010) (4 pages) doi:10.1115/1.4001615 History: Received July 03, 2009; Revised March 01, 2010; Published June 29, 2010; Online June 29, 2010

Experimental studies are presented to show the effect of thermal stresses on thermal contact conductance (TCC) at low contact pressures. It is observed that in a closed contact assembly, contact pressure acting on the interface changes with the changing temperature of contact members. This change in contact pressure consequently causes variations in the TCC of the junction. A relationship between temperature change and the corresponding magnitude of developed thermal stress in a contact assembly is determined experimentally. Inclusion of a term called temperature dependent load correction factor is suggested in the theoretical model for TCC to make it capable of predicting TCC values more accurately in contact assemblies that experience large temperature fluctuations.

Copyright © 2010 by American Society of Mechanical Engineers
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Figure 1

Test column assembly

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Figure 2

(a) Variation in contact pressure with interface temperature. (b) Variation in thermal stress with change in interface temperature.

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Figure 3

Comparison of TCC measurements made by increasing the temperature and by increasing the contact pressure in vacuum, nitrogen, and argon environments

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Figure 4

Comparison of experimental data with the theoretical model (with and without modification)




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