0
Research Papers: Forced Convection

A Semi-Empirical Heat Transfer Model for Forced Convection in Pin-Fin Heat Sinks Subjected to Nonuniform Heating

[+] Author and Article Information
S. S. Feng

School of Energy and Power Engineering, Xi’an Jiaotong University, Xi’an 710049, P.R. China

T. Kim1

SV Laboratory, School of Aerospace, Xi’an Jiaotong University, Xi’an 710049, P.R. Chinatongbeum@gmail.com

T. J. Lu

SV Laboratory, School of Aerospace, Xi’an Jiaotong University, Xi’an 710049, P.R. China

1

Corresponding author.

J. Heat Transfer 132(12), 121702 (Sep 17, 2010) (11 pages) doi:10.1115/1.4002285 History: Received September 24, 2009; Revised May 11, 2010; Published September 17, 2010; Online September 17, 2010

This paper presents a cost effective semi-empirical analytical model for convective heat transfer in pin-fin heat sinks subjected to nonuniform heating set by a circular hot gas impinging jet. Based on empirical correlations taken from the open literature, temperature variations in the heat sink are obtained from the finite volume solution of the semi-empirical model. Based on a purpose-built experimental setup, measurements of a substrate temperature are performed using an infrared camera. These, along with the convective fluid temperature measured at the exit of the pin-fin array, are compared against analytical model predictions, with overall good agreement achieved. Subsequently, the influences of the convection Reynolds number, substrate thickness, and thermal conductivity of material on the distribution of substrate temperature are quantified by the validated model. It is demonstrated that the present model is capable of predicting local thermal behaviors such as the footprints of the pin fins. In addition, with the spreading resistance captured accurately, the model can be used for the design optimization of pin-fin/substrate systems subjected to nonuniform heating.

FIGURES IN THIS ARTICLE
<>
Copyright © 2010 by American Society of Mechanical Engineers
Your Session has timed out. Please sign back in to continue.

References

Figures

Grahic Jump Location
Figure 1

Schematic of (a) square pin-fin heat sink and (b) test setup for nonuniform impingement heating

Grahic Jump Location
Figure 2

Comparison of presently measured nondimensional adiabatic wall temperature distribution with that of Goldstein (15)

Grahic Jump Location
Figure 3

Heat balance in a representative unit cell of pin-fin heat sink

Grahic Jump Location
Figure 4

Computational mesh for substrate: (a) 3D mesh for half of substrate; (b) plan view from positive z-direction showing pin fins (dark squares)

Grahic Jump Location
Figure 5

Surface temperature mappings on substrate (z=0) at ReDh=1.0×104, with convective flow direction from negative x value to positive x value: (a) experiment; (b) prediction from semi-empirical model

Grahic Jump Location
Figure 6

Fluid temperature in pin-fin heat sink: (a) predicted fluid temperature map at ReDh=1.0×104; (b) comparison of measured temperature profiles at channel exit (x=L/2) along y-axis with those predicted

Grahic Jump Location
Figure 7

Heat flux distribution on substrate surface exposed to fluid flow

Grahic Jump Location
Figure 8

Effect of convection Reynolds numbers on substrate temperature profile along x-axis (y=0)

Grahic Jump Location
Figure 9

Peak substrate temperature (θpeak) plotted as a function of convection Reynolds number

Grahic Jump Location
Figure 10

Influence of substrate thickness on temperature profiles of outer and inner substrate surfaces along x-axis at y=0 for ReDh=1.0×104: (a) ks=169 W/m K (Al alloy); (b) ks=15 W/m K (stainless steel)

Grahic Jump Location
Figure 11

Distribution of substrate temperature (z=0) along x-axis (y=0) plotted as a function of substrate thermal conductivity for fixed substrate thickness (t/d=0.2) at ReDh=1.0×104

Tables

Errata

Discussions

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In