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Research Papers: Experimental Techniques

Numerical Investigation of Electrohydrodynamic-Conduction Pumping of Liquid Film in the Presence of Evaporation

[+] Author and Article Information
Miad Yazdani

Two-Phase Flow and Heat Transfer Enhancement Laboratory, Mechanical, Materials and Aerospace Engineering Department, Illinois Institute of Technology, Chicago, IL 60616myazdan1@iit.edu

Jamal Seyed-Yagoobi

Two-Phase Flow and Heat Transfer Enhancement Laboratory, Mechanical, Materials and Aerospace Engineering Department, Illinois Institute of Technology, Chicago, IL 60616yagoobi@iit.edu

J. Heat Transfer 131(1), 011602 (Oct 22, 2008) (8 pages) doi:10.1115/1.2993542 History: Received October 15, 2007; Revised August 07, 2008; Published October 22, 2008

Electrohydrodynamic (EHD) conduction pumping is associated with the heterocharge layers of finite thickness in the vicinity of the electrodes, generated by the process of dissociation of the neutral electrolytic species and the recombination of the generated ions. This paper numerically investigates the EHD-conduction pumping of a liquid film in the presence of evaporation. The flow system comprises a liquid film flowing over a two-dimensional flat plate. The vapor phase above the flat plate is extended far beyond the interface. The channel is separated into four different sections: the entrance, electrode, evaporation, and downstream sections. The entrance, electrode, and downstream regions are adiabatic while a constant heat flux is applied in the evaporation section. The concept of EHD-conduction pumping of liquid film in the presence of phase change is numerically demonstrated in this paper. The resultant heat transfer due to conduction pumping is evaluated as well. The results for heat transfer coefficient along the channel indicate considerable improvement of heat transfer coefficient compared with the pressure-driven counterpart.

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Copyright © 2009 by American Society of Mechanical Engineers
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Figures

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Figure 1

Schematic of 2D solution domain (not to scale). The interface profile presented is merely for illustration purposes.

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Figure 2

Liquid film interface profile and corresponding streamlines

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Figure 3

Dimensionless contours of electric field: (a) streamwise direction, Ex∗, and (b) spanwise direction, Ey∗

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Figure 4

Dimensionless contours of net charge density, p∗−n∗

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Figure 5

Dimensionless contours of electric body force: (a) streamwise direction, fe∗x, and (b) spanwise direction, fe∗y

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Figure 6

Streamwise and spanwise velocity profiles at x∗=11.1(x=66.6 mm)

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Figure 7

Local and average Nusselt numbers along the dimensionless channel length in the evaporation section for EHD-conduction induced and pressure-driven flows

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Figure 8

Local and average Nusselt numbers along the dimensionless channel length in the evaporation section for EHD-conduction induced flow at two levels of Pel and C0 with M0 fixed

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Figure 9

Variation in average Nusselt number along the evaporation section and dimensionless liquid film thickness at the channel outlet as a function of Pel and C0−1

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Figure 10

Variation in average Nusselt number along the evaporation section and dimensionless liquid film thickness at the channel outlet as a function of C0 with Pel and M0 kept constant

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Figure 11

Local and average Nusselt numbers along the dimensionless channel length in the evaporation section for EHD-conduction induced flow at two levels of M0

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Figure 12

Variation in average Nusselt number along the evaporation section and dimensionless liquid film thickness at the channel outlet as a function of M0

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