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MICRO/NANOSCALE HEAT TRANSFER—PART I

Heat Transfer Characterizations of Heat Pipe in Comparison With Copper Pipe

[+] Author and Article Information
Chen-Ching Ting

Department of Mechanical Engineering, National Taipei University of Technology, No. 1, Sec. 3, Chung-Hsiao E. Road, Taipei 10608, Taiwanchchting@ntut.edu.tw

Jing-Nang Lee1

Graduate Institute of Manufacturing Technology, National Taipei University of Technology, No. 1, Sec. 3, Chung-Hsiao E. Road, Taipei 10608, Taiwan

Chien-Chih Chen

Graduate Institute of Manufacturing Technology, National Taipei University of Technology, No. 1, Sec. 3, Chung-Hsiao E. Road, Taipei 10608, Taiwan

1

Also at Department of Refrigeration, Air-Conditioning, and Energy Engineering, National Chin-Yi University of Technology, Taiwan.

J. Heat Transfer 131(3), 033109 (Jan 23, 2009) (6 pages) doi:10.1115/1.3056571 History: Received June 09, 2008; Revised October 20, 2008; Published January 23, 2009

The article presents some significant experimental data for studying the heat transfer behavior of heat pipe, which will further help the cooling efficiency improvement of the heat pipe cooler. It is well known that the heat pipe owns the extreme large heat conductivity and is often integrated with cooling plates for CPU cooling. The heat pipe uses special heat transfer techniques to obtain extremely large heat conductivity, which are the inside liquid evaporation for heat absorption and the inside microstructural capillarity for condensation. These special techniques yield the instant heat transfer from the heat source to the remote side directly, but the special heat transfer behavior is changed due to the integration with cooling plates. The destroyed heat transfer behavior of the heat pipe causes the cooling efficiency of the heat pipe cooler to be not able to reach a predicted good value. To improve the cooling efficiency of the heat pipe cooler we recover the original heat transfer behavior of the heat pipe integrated with cooling plates. This work first built a CPU simulator in accordance with the ASTM standard for heating the heat pipe, then uses the color schlieren technique to visualize the sequent heat flux nearby the heat pipe and the infrared thermal camera for quantitative temperature measurements synchronously. The result shows that the heat flux first appears at the opposite side from the heat source and there exhibits also the highest temperature. This is different from the heat transfer behavior of the copper pipe. Another very interesting result is that the heat flux of the cooling plate nearest to the heat source is first viewed than the others, which is similar to the integration with the copper pipe.

Copyright © 2009 by American Society of Mechanical Engineers
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References

Figures

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Figure 1

TDP development of Intel P4 CPU (1)

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Figure 2

Schema of the general heat pipe cooler

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Figure 3

Photo of the heat pipe built on the CPU simulator

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Figure 4

Schematic cross section of the heat pipe

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Figure 5

Capturing screen of the infrared thermal camera corresponding to the position of the heated copper and heat pipes

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Figure 6

Photo of the schlieren setup with typical Z-arrangement

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Figure 7

Schematic setup of the heat pipe with the cooling plates

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Figure 8

The time dependent change in the surface temperature distribution for the copper pipe heated by the 300 W CPU simulator

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Figure 9

The time dependent change in the surface temperature distribution for the heat pipe heated by the 300 W CPU simulator

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Figure 10

The zoomed out result from Fig. 9 at the point of time ~120 s

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Figure 11

The heat flux visualization of the copper pipe using the infrared thermal photography heated by the 300 W CPU simulator

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Figure 12

The heat flux visualization of the heat pipe using the infrared thermal photography heated by the 300 W CPU simulator

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Figure 13

The heat flux visualization of the copper pipe using the color schlieren technique heated by the 300 W CPU simulator

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Figure 14

The heat flux visualization of the heat pipe using the schlieren technique heated by the 300 W CPU simulator

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Figure 15

The heat flux visualization of the heat pipe cooler with one cooling plate using the schlieren technique heated by the 300 W CPU simulator

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Figure 16

The heat flux visualization of the heat pipe cooler with five cooling plates using the schlieren technique heated by the 300 W CPU simulator

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