Research Papers: Micro/Nanoscale Heat Transfer

Measurement of the Heat Capacity of Copper Thin Films Using a Micropulse Calorimeter

[+] Author and Article Information
Jun Yu

Department of Electronic Engineering, Dalian University of Technology, Dalian, Liaoning 116024, Chinajunyu@dlut.edu.cn

Zhen’an Tang, Fengtian Zhang, Haitao Ding, Zhengxing Huang

Department of Electronic Engineering, Dalian University of Technology, Dalian, Liaoning 116024, China

J. Heat Transfer 132(1), 012403 (Oct 26, 2009) (6 pages) doi:10.1115/1.3211864 History: Received September 30, 2008; Accepted July 20, 2009; Published October 26, 2009

This paper presents a micropulse calorimeter for heat capacity measurement of thin films. Optimization of the structure and data processing methods of the microcalorimeter improved the thermal isolation and temperature uniformity and reduced the heat capacity measurement errors. Heat capacities of copper thin films with thicknesses from 20 nm to 340 nm are measured in the temperature range from 300 K to 420 K in vacuum of 1 mPa. The specific heat of the 340 nm Cu film is close to the literature data of bulk Cu. For the thinner films, the data shows that the specific heat increases with the decreasing of film thickness (or the average crystalline size).

Copyright © 2010 by American Society of Mechanical Engineers
Your Session has timed out. Please sign back in to continue.



Grahic Jump Location
Figure 5

Typical power curves during a test run

Grahic Jump Location
Figure 1

Structure of the microcalorimeter and FEA temperature distribution

Grahic Jump Location
Figure 2

Microcalorimeter: (a) fabrication process flow, (b) SEM photo, and (c) with sample film

Grahic Jump Location
Figure 3

The microcalorimeter’s temperature dependence on air pressure at I=0.7 mA

Grahic Jump Location
Figure 4

Temperature versus power consumption

Grahic Jump Location
Figure 6

A schematic of the experimental setup used for heat capacity characterization of thin films with the microcalorimeter

Grahic Jump Location
Figure 7

Typical temperature data and the exponential fitting curve

Grahic Jump Location
Figure 8

Heat capacity of three adjacent microcalorimeters

Grahic Jump Location
Figure 9

Heat capacity of the copper films

Grahic Jump Location
Figure 10

Specific heat of the copper films

Grahic Jump Location
Figure 11

cp film/cp bulk versus the crystalline diameter d at T=350 K




Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In