0
Micro/Nanoscale Heat Transfer

The Phonon Thermal Conductivity of Single-Layer Graphene From Complete Phonon Dispersion Relations

[+] Author and Article Information
Yunfeng Gu

College of Electronic and Mechanical Engineering, Nanjing Forestry University, Nanjing 210037, People’s Republic of China; Jiangsu Key Laboratory for Design and Manufacture of Micro-Nano Biomedical Instruments, Key Laboratory of MEMS of China Educational Ministry,  Southeast University, Nanjing, 210096, People’s Republic of China

Zhonghua Ni, Minhua Chen, Kedong Bi

 Jiangsu Key Laboratory for Design and Manufacture of Micro-Nano Biomedical Instruments, Key Laboratory of MEMS of China Educational Ministry,Southeast University, Nanjing, 210096, People’s Republic of Chinayunfeichen@seu.edu.cn

Yunfei Chen1

 Jiangsu Key Laboratory for Design and Manufacture of Micro-Nano Biomedical Instruments, Key Laboratory of MEMS of China Educational Ministry,Southeast University, Nanjing, 210096, People’s Republic of Chinayunfeichen@seu.edu.cn

1

Corresponding author.

J. Heat Transfer 134(6), 062401 (May 09, 2012) (8 pages) doi:10.1115/1.4005743 History: Received September 02, 2010; Revised October 07, 2011; Published May 09, 2012

In this paper, the phonon scattering mechanisms of single-layer graphene are investigated based on the complete phonon dispersion relations. According to the selection rules that a phonon scattering process should obey the energy and momentum conservation conditions, the relaxation rates of combining and splitting umklapp processes can be calculated by integrating the intersection lines between different phonon mode surfaces in the phonon dispersion relation space. The dependence of the relaxation rates on the wave vector directions is presented with a three-dimensional surface over the first Brillouin zone. It is found that the reason for the optical phonons contributing little to heat transfer is attributed to the strong umklapp processes but not to their low phonon group velocities. The combining umklapp scattering processes involving the optical phonons mainly decrease the acoustic phonon thermal conductivity, while the splitting umklapp scattering processes of the optical phonons mainly restrict heat conduction by the optical phonons themselves. Neglecting the splitting processes, the optical phonons can contribute more energy than that carried by the acoustic phonons. Based on the calculated phonon relaxation time, the thermal conductivities contributed from different mode phonons can be evaluated. At low temperatures, both longitudinal and in-plane transverse acoustic phonon thermal conductivities have T2 temperature dependence, and the out-of-plane transverse acoustic phonon thermal conductivity is proportion to T3/2. The calculated thermal conductivity is on the order of a few thousands W/(m K) at room temperature, depending on the sample size and the edge roughness, and is in agreement well with the recently measured data in the temperature range from about 350 K to 500 K.

FIGURES IN THIS ARTICLE
<>
Copyright © 2012 by American Society of Mechanical Engineers
Your Session has timed out. Please sign back in to continue.

References

Figures

Grahic Jump Location
Figure 1

A schematic illustration of the possible (a) combining U process and (b) splitting U process for a phonon mode q. The wave vector q′ is in the BZ with the point Γ0 as its center and having a dash point line edge.

Grahic Jump Location
Figure 2

Phonon dispersion relations of the SLG in the triangular area ΔΓKM edged with the symmetry lines in the BZ. There are three acoustic phonon branches (LA, iTA, and oTA) and three optical phonon branches (LO, iTO, and oTO).

Grahic Jump Location
Figure 3

Construction for the interaction of three phonons: (a) the combining U process and (b) the splitting U process

Grahic Jump Location
Figure 4

The wave vector dependence of the relaxation rate of iTA phonons undergoing a combining U process (a) and a splitting U process (b) at 300 K

Grahic Jump Location
Figure 5

The frequency dependence of the relaxation rate of iTA phonons undergoing a combining U process at 300 K

Grahic Jump Location
Figure 6

A comparison between the total thermal conductivity calculated in this paper with those in previous literatures

Grahic Jump Location
Figure 7

The thermal conductivity as a function of temperature

Grahic Jump Location
Figure 8

The temperature dependence of the acoustic phonon thermal conductivity and their approximate results

Tables

Errata

Discussions

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In