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TECHNICAL PAPERS: Heat Transfer in Manufacturing

Transient Elastic Thermal Stress Development During Laser Scribing of Ceramics

[+] Author and Article Information
Michael F. Modest, Thomas M. Mallison

Department of Mechanical Engineering, The Pennsylvania State University, University Park, PA 16802

J. Heat Transfer 123(1), 171-177 (Sep 11, 2000) (7 pages) doi:10.1115/1.1332779 History: Received December 07, 1999; Revised September 11, 2000
Copyright © 2001 by ASME
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References

Figures

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Laser scribing setup and coordinate system
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Intermediate principal stress distribution during CW CO2 laser drilling; time=1.8 ms
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Maximum principal stress distribution during CW CO2 laser drilling; time=1.8 ms
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Maximum principal stress distribution during CW CO2 laser scribing commencing after drilling for 1.8 ms; time=2.5 ms
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Intermediate principal stress distribution during CW CO2 laser scribing; time=2.5 ms
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Maixmum principal stress distribution during CW CO2 laser scribing; time=3.5 ms
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SEM cross-section of CW CO2 laser scribed of α-SiC (power P=600 W, laser scan velocity=5 cm/s)
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Intermediate principal stress distribution during pulsed CO2 laser scribing; time=2.2 ms
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Maximum principle stress distribution during pulsed CO2 laser scribing; time=2.2 ms

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