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TECHNICAL PAPERS: Heat Transfer in Manufacturing

Transient Elastic Thermal Stress Development During Laser Scribing of Ceramics

[+] Author and Article Information
Michael F. Modest, Thomas M. Mallison

Department of Mechanical Engineering, The Pennsylvania State University, University Park, PA 16802

J. Heat Transfer 123(1), 171-177 (Sep 11, 2000) (7 pages) doi:10.1115/1.1332779 History: Received December 07, 1999; Revised September 11, 2000
Copyright © 2001 by ASME
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References

Copley, S. W., Wallace, R. J., and Bass, M., 1983, “Laser Shaping of Materials,” in Lasers in Materials Processing, E. A. Metzbower, ed., American Society for Metals, Metals Park, OH.
Yamamoto, J., and Yamamoto, Y., 1987, “Laser Machining of Silicon Nitride,” in International Conference on Laser Advanced Materials Processing—Science and Applications, Osaka, Japan, High Temperature Society of Japan, Japan Laser Processing Society, pp. 297–302.
DeBastiani,  D., Modest,  M. F., and Stubican,  V. S., 1990, “Mechanisms of Reactions During CO2-Laser Processing of Silicon Carbide,” J. Am. Ceram. Soc., 73, No. 7, pp. 1947–1952.
Hasselman,  D. P. H., Thomas,  J. R., Kamat,  M. P., and Satyamurthy,  K., 1980, “Thermal Stress Analysis of Partially Absorbing Brittle Ceramics Subjected to Symmetric Radiation Heating,” J. Am. Ceram. Soc., 63, No. 1–2, pp. 21–25.
Thomas,  J. R., Singh,  J. P., and Hasselman,  D. P. H., 1981, “Analysis of Thermal Stress Resistance of Partially Absorbing Ceramic Plate Subjected to Asymmetric Radiation: I—Convective Cooling at Rear Surface,” J. Am. Ceram. Soc., 64, No. 3, pp. 163–173.
Singh,  J. P., Sumi,  N., Thomas,  J. R., and Hasselman,  D. P. H., 1981, “Analysis of Thermal Stress Resistance of Partially Absorbing Ceramic Plate Subjected to Asymmetric Radiation: II—Convective Cooling at Front Surface,” J. Am. Ceram. Soc., 64, pp. 169–173.
Bradley,  F., 1988, “Thermoelastic Analysis of Radiation-Heating Thermal Shock,” High Temp. Technol., 6, No. 2, pp. 63–72.
Sumi,  N., Hetnarski,  R. B., and Noda,  N., 1987, “Transient Thermal Stresses Due to a Local Source of Heat Moving Over the Surface of an Infinite Elastic Slab,” J. Thermal Stresses, 10, pp. 83–96.
Ferrari,  M., and Harding,  J. H., 1992, “Thermal Stress Field in Plasma-Sprayed Ceramic Coatings,” J. Energy Resour. Technol., 114, pp. 105–109.
Gross,  T. S., Hening,  S. D., and Watt,  D. W., 1991, “Crack Formation During Laser Cutting of Silicon,” J. Appl. Phys., 69, No. 2, pp. 983–989.
Modest,  M. F., 1998, “Transient Elastic and Viscoelastic Thermal Stresses During Laser Drilling of Ceramics,” ASME J. Heat Transfer, 120, pp. 892–898.
Modest,  M. F., 1996, “Three-Dimensional, Transient Model for Laser Machining of Ablating/Decomposing Materials,” Int. J. Heat Mass Transf., 39, No. 2, pp. 221–234.
Roy,  S., and Modest,  M. F., 1993, “CW Laser Machining of Hard Ceramics: Part I—Effects of Three-Dimensional Conduction and Variable Properties and Various Laser Parameters,” Int. J. Heat Mass Transf., 36, No. 14, pp. 3515–3528.
Boley, B. A., and Weiner, J. H., 1960, Theory of Thermal Stresses, Wiley, New York.
Thompson, J. F., Warsi, Z. U. A., and Mastin, C. W., 1985, Numerical Grid Generation, Foundations and Applications, North-Holland, New York.

Figures

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Laser scribing setup and coordinate system
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Intermediate principal stress distribution during CW CO2 laser drilling; time=1.8 ms
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Maximum principal stress distribution during CW CO2 laser drilling; time=1.8 ms
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Maximum principal stress distribution during CW CO2 laser scribing commencing after drilling for 1.8 ms; time=2.5 ms
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Intermediate principal stress distribution during CW CO2 laser scribing; time=2.5 ms
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Maixmum principal stress distribution during CW CO2 laser scribing; time=3.5 ms
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SEM cross-section of CW CO2 laser scribed of α-SiC (power P=600 W, laser scan velocity=5 cm/s)
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Intermediate principal stress distribution during pulsed CO2 laser scribing; time=2.2 ms
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Maximum principle stress distribution during pulsed CO2 laser scribing; time=2.2 ms

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