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Research Papers: Evaporation, Boiling, and Condensation

Enhancement of Saturation Boiling of PF-5060 on Microporous Copper Dendrite Surfaces

[+] Author and Article Information
Mohamed S. El-Genk1

Regents’ Professor, Department of Chemical and Nuclear Engineering, and Department of Mechanical Engineering, University of New Mexico, Albuquerque, NM 87131; Director of Institute for Space and Nuclear Power Studies (ISNPS), University of New Mexico, Albuquerque, NM 87131mgenk@unm.edu

Amir F. Ali

Research Assistant, ISNPS, University of New Mexico, Albuquerque, NM 87131; Department of Mechanical Engineering, University of New Mexico, Albuquerque, NM 87131

1

Corresponding author.

J. Heat Transfer 132(7), 071501 (Apr 28, 2010) (9 pages) doi:10.1115/1.4000975 History: Received June 02, 2009; Revised November 24, 2009; Published April 28, 2010; Online April 28, 2010

Experiments are performed to investigate saturation boiling of degassed PF-5060 dielectric liquid on microporous copper dendrite surface layers deposited on 10×10mm2 Cu substrates. The electrochemically deposited surface layers are of different thicknesses (145.6μm, 46.3μm, and 33.1μm). The thickest layer gives the best results: the saturation CHF of 25.27W/cm2 occurs at a surface superheat of only 2.9 K and the maximum nucleate boiling heat transfer coefficient, hMNB, near the end of the fully developed nucleate boiling region, is 8.76W/cm2K. In addition, nucleate boiling ensues at a surface temperature slightly above saturation (<0.5K), with no temperature excursion. The temperature excursions before initiating boiling on the 46.3μm and 33.1μm thick Cu nanodendrite surface layers are small (3.7 K and 6 K), corresponding to surface temperatures of 55.1°C and 57.4°C, respectively. These temperatures are much lower than recommended (85°C) for reliable operation of most silicon electronics and central processor units.

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Copyright © 2010 by American Society of Mechanical Engineers
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References

Figures

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Figure 1

SEM images of Cu nanodendrites deposited using high current density (21)

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Figure 2

SEM images of the structurally strengthened Cu Nanodendrite surface layers used in the present pool boiling experiments (500×).

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Figure 3

Assembled test section

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Figure 4

A Schematic of the experimental setup

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Figure 5

Boiling and hNB curves of PF-5060 on surface layer 2

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Figure 6

Boiling hysteresis of PF-5060 on surface 2 (Table 2)

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Figure 7

Boiling and hNB curves of PF-5060 on different Cu nanodendrite surface layers (Table 2)

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Figure 8

Saturation boiling of FC-72 and PF-5060 on microstructured, microporous, and plane Cu surfaces

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Figure 9

An Illustration of pool boiling of dielectric liquid on Cu nanodendrite surface layers

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